Technical Features Europe
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By Paul Whytock, May 22, 2012
If you’re heading to the show, be sure to make the most of the semiconductors, sausages, and sauerkraut.
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By Staff, May 22, 2012
Students from the Technical University of Iasi, Romania, won the final round of the EMEA Freescale Cup Challenge, a competition where student teams build, program, and race an intelligent model car.
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By Paul Whytock, May 15, 2012
Selected from a total of 230 contributions, it focuses on next-generation silicon-carbide (SiC) planar MOSFETs, trench structure Schottky diodes, and trench MOSFETs.
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By Paul Whytock, May 15, 2012
A pan Eurpoean partnership between AMS Technologies, provider of power and thermal-management products, and Electrovipryamitel, developer and manufacturer of IGBTs, SFRD modules, and diode-thyristors, will provide local design support for next-generation power electronics applications.
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By Alberto Guerra, May 09, 2012
Traditional interior permanent magnet (IPM) solutions for the 30W to 200W inverterised motor-drive market require either a large construction or use of an external heatsink. International Rectifier's alternative approach uses PCB copper traces to dissipate heat from the module. As a result, it has a smaller package design and can eliminate an external heatsink.
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By Paul Whytock, May 09, 2012
IGBT and FET innovations stole the thunder at PCIM 2012. Switching and on-resistance efficiencies lay at the heart of many such breakthroughs.
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By Dr. Georges Tchouangue, May 08, 2012
Dr. Georges Tchouangue, Chief Engineer at Toshiba Electronics Europe (TEE), discusses how new fabrication processes and techniques are helping power semiconductors address stringent performance, efficiency, space and noise criteria.
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By Paul Whytock, May 08, 2012
PCIM 2012 Europe occupied two halls. In addition to exhibiting companies the show offered panel discussions, VIP interviews, a round table, and over 50 vendor presentations
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By Staff, May 08, 2012
Fairchild Semiconductor demonstrated a range of power solutions at PCIM, featuring silicon and solutions for industrial power, automotive, LED lighting, and dc-dc conversion.
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By Staff, May 08, 2012
Richardson RFPD has new gallium-nitride (GaN) on silicon-carbide (SiC) family of power transistors from M/A-COM Technology Solutions.
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By Staff, May 08, 2012
Renesas Electronics added eight low-loss P- and N-channel power MOSFETs, optimised for use in portable electronics such as smartphones and tablets, to its range of devices.
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By Staff, May 08, 2012
Toshiba expanded its TC74VHC family of very-high-speed logic with a range of ICs that combine Schmitt trigger inputs with voltage-tolerant output capabilities.
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By , May 08, 2012
Gateway Electronic Components has secured an agreement with TDK to distribute EPCOS and TDK products in the UK
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By Gordon Lunn, May 01, 2012