Physical Layer Test Challenges and Solutions for MIPI Interfaces

Sponsored by Agilent Technologies

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The Mobile Industry Processor Interface (MIPI) Alliance standards body standardizes interfaces for mobile applications and designs. The MIPI D-PHY and M-PHY are introduced as high-speed physical layers, which are used in multiple applications such as camera, display, memory and baseband. Other protocols including USB 3.0 and PCIe are also in the process of being adapted to work with the M-PHY physical layer as well. Since D-PHY and M-PHY are optimized for performance and power consumption, there are many new validation challenges. In addition, they have to comply with the requirements outlined in the MIPI Conformance Test Suites, which are key to system interoperability. If you are developing or validating these MIPI-based designs, you'll want to attend this webcast to understand how to overcome the physical layer test challenges.

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