New and emerging technologies for 3D packaging are being deployed at the printed-circuit-board (PCB) level. Power-density goals can be simplified with component integration into chip-scale packages that use stacking techniques, integration, transposers, and more. Advanced cooling methods will help make 3D packaging a viable option.
The latest technology innovations and cooling methods will improve power density in new designs and upgrade it in older designs. These innovations and methods, in this article, will greatly improve the power density in 3D power packaging.