Mediagfx_136681258
Dreamstime Mediagfx 136681258 634dbcd059de9

Thermal Interface Materials: Cool Options for Better Power Density (Download)

Oct. 17, 2022

Read this article online.

One of the most important—and difficult—design decisions for circuit designers is creating an optimum heatsink method for high-power devices/systems such as power processors and power supplies. A key area of expertise is the attachment method of an electronic power device to a heatsink or a heat spreader. As power densities increase in power electronics, the thermal interface in between the power module/device and heatsink is now a bigger challenge for designers.

The bottom line is to have a solid thermal contact that will direct most of the heat away from the electronic power devices and on through a heatsink.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!