Integration of SiC and GaN in power electronics continues to ramp up. Power Integrations’ Andy Smith discusses the latest advances in WBG tech, including a new 1,700-V GaN switch developed by PI.
Discover how TSN integration can simplify machine architectures by enabling a single communication backbone, reducing the complexity of deterministic traffic management in ecosystems like Industry 4.0.
Today's advanced products, from consumer wearables to smart EVs, are starting to leverage the power of AI to increase performance and functionality. However, those solutions require the appropriate hardware to run on.
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