In this training series, we discuss the high level of integration of DC/DC power modules and the significant implications that this has on power supply design. In addition to high power density and small solution size, modules can also simplify EMI mitigation and reduce power supply design time. And thanks to improved process and packaging technology, a power module may even provide all of these benefits with a lower overall solution cost as well.

An integrated inductor and minimum solution size doesn’t necessarily require a compromise with respect to thermal performance. Learn why in this application brief.    

Get an overview of the most diverse portfolio of DC/DC power modules in the industry. Use the guide to learn about all the latest and best TI power modules and to find the one that is best for your next design.

TI’s MicroSiP packaging provides maximum integration and minimum solution size. In the paper, we take a deep dive into manufacturing considerations with the MicroSiP package, including guidelines for layout, assembly, and rework.