PICMG has ratified version 1.2 of the COM-HPC specification, packing high-performance capabilities onto a mini footprint of 95x70 mm. Engineers can leverage the COM-HPC Mini modules to bring their rugged small form factor designs to new heights of performance, bandwidth, and I/O capabilities.

Featuring soldered processor and memory as well as support for extended temperatures from -40°C to +85°C, our new COM-HPC Mini module lets you unleash the full power and bandwidth of 13th Gen Intel® Core™ processor technology in your small form factor and rugged embedded designs.

Have more space? Check out COM-HPC Client Size A high performance module based on 13th Gen Intel® Core™ processor series. Intel® hybrid design combines Performance-cores with Efficient–cores Featuring soldered processor and memory plus support for extended temperatures from -40°C to +85°C.

Our COM-HPC ecosystems are specifically engineered to provide everything developers need to be first to market with industry-leading solutions that deliver highest performance and bandwidth for all the new and emerging AI-powered edge computing and embedded server applications.

COM-HPC standard will be a powerful game changer for future-proofing embedded designs. Experts Claire and Christian, chairman of the PICMG COM-HPC working group, explain why COM-HPC Mini is an ideal fit for space and power constrained applications like autonomous mobile robots.