ams OSRAM OSLON^® Boost HM KW CELMM2.TK LEDs employ the high current capability of the recent chip generation in a special package for excellent thermal behaviour. These LEDs incorporate high luminance of ≤275cd/mm² and a high luminous flux in order to suit powerful light sources for ultra-slim headlamp designs.

Taiwan Semiconductor TSHA2101CQ Integrated AMR Magnetic Sensor supports both 2-wire and 3-wire applications for cylinder position detection. When coupled with a magnet, this integrated AMR magnetic sensor transforms into a non-contact switch with low power consumption, high sensitivity, and high reliability.

CUI Devices Spring Contact Speakers offer a miniature design with dimensions of ≤40mm and a power range of 0.3W to 2W. These speakers are available with a coiled spring contact, tension spring contact, spring leaf contact, or spring contact.

NXP Semiconductors GD3162 Advanced IGBT/SiC Gate Drivers are ideal for SiC and IGBT modules in xEV traction inverters. GD3162 drivers enable space savings and performance through advanced gate-drive functionality. The device includes integrated galvanic isolation, a programmable SPI interface, and advanced protection features like overtemperature, desaturation, and current sense protection.

Analog Devices Inc. MAX40109 Low-Power Precision Sensor Interface SoCs include a high-precision, programmable Analog Front-End (AFE), Analog-to-Digital Converter (ADC), calibration memory, and digital signal processing. The devices provide a Digital-to-Analog Converter (DAC) with an output buffer to support analog voltage output and a 4mA to 20mA current loop.

Phoenix Contact ONEPAIR SPE M12 Connectors and Cables feature M12 male and female contacts for established inductive sensors and flying leads. The established Ethernet protocol in SPE advances final automation levels and forms the basis for future-proof networking.

Weidmuller UH20 u-maker Box is designed to make more out of the Raspberry Pi 4 by providing a housing system that is modular, smart, and simple. This RasPi enclosure is easy to assemble and design flexible to fit a variety of projects, such as building and programming smart home devices.

u-blox NEO-M8L GNSS Module integrates GNSS, inertial sensing, and speed information from the vehicle to offer constant and precise positioning for telematics, navigation, and Vehicle-to-Everything (V2X) applications. The position engine tolerates missing wheel sensor data and supports UDR mode in the absence of any wheel sensor data.

Infineon Technologies AIROC™ CYW920829M2EVK-02 BLUETOOTH^® LE SoC Evaluation Kit allows users to evaluate, prototype, and develop a wide array of Bluetooth applications using the AIROC CYW20829 ultra-low-power Bluetooth LE 5.4 MCU. The CYW20829 delivers a long-range performance without an external power amplifier (ePA) and robust ultra-low latency HID without dongles.

KEMET Metallized Paper EMI Suppression AEC-Q200 Capacitors feature a multilayer, metallized paper construction encapsulated and impregnated in UL 94V-0 self-extinguishing material. The capacitors are AEC-Q200 qualified, can withstand high vibration and provide a 310VAC rated voltage and 630VDC recommended DC voltage rating while maintaining stability against corrosion and electrochemical corrosion.