XPedite2770 is a high-performance, reconfigurable, 3U VPX FPGA module based on the AMD Versal^® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It includes integrated security features to protect sensitive data.

The Vela IF820 Series is a great way to develop for dual-mode Bluetooth applications with all of Ezurio's value-added software & development options. Hosted or hostless, the Vela IF820 module provide a platform to either design new Bluetooth Classic + Bluetooth Low Energy applications or refresh your legacy designs, with either an onboard antenna or external antenna option available.

To verify the performance of high power artificial intelligence chip, 80+ GHz bandwidth elastomer socket can be used with heatsink/axial flow fan to remove 250+ watts of heat generation. Elastomer socket is transparent such that the performance is equivalent to direct solder version. Self inductance of elastomer is 0.1nH and the socket can be operated from -55C to +160C.

Master Bond EP17HTDA-2 is a heat curing adhesive that can be used for bonding, sealing and die attachment. This dimensionally stable system features both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a T_g of 185-190°C.