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    44mythspromo
    EDA

    44 Myths About Chip Verification eBook (Download)

    Many misconceptions have emerged about chip simulation and verification tools and techniques. Download this eBook, which collects together four of our most popular 11 Myths articles...
    AMD, Chiplet Summit
    Semiconductors

    Multi-Die Systems @ Chiplet Summit 2024

    Check out the latest chiplet and packaging technology at this year's Chiplet Summit.
    309588159 © Alexei Onufriiciuc | Dreamstime.com
    Embedded

    Ethernet Tailored for the AI Era

    The latest Ethernet PHY and controller IP from Synopsys can crank out up to 1.6 Tb/s of bandwidth.
    NVIDIA and dreamstime_wrightstudio_132
    Embedded

    NVIDIA’s Blackwell GPU: Driving the Future of AI

    The latest Blackwell GPU is the result of innovations in everything from the transistors themselves to the architecture, advanced packaging, connectivity, and memory.
    86230086 © Flynt | Dreamstime.com
    EDA

    Packaging Chiplets for Performance and Profit

    When it comes to chiplets, it’s all about packaging technology.
    GTC March 2024 Keynote with NVIDIA CEO Jensen Huang
    Machine Learning

    Presenting the Blackwell GPU @ GTC 2024

    The latest NVIDIA Blackwell GPU helps accelerate artificial-intelligence chores.

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    Dashark | Dreamstime.com
    Ed Verification Promo dashark Dreamstime Wafer Stock Promo 6345bfb2a48ef

    TechXchange: Addressing Chip Verification Challenges

    Integrated circuits go through detailed verification before ever making a real chip, allowing developers to be confident that the chip will work once it's produced.
    Rusian Gilyazov | Dreamstime.com
    Pcb Ed Promo Electronic Hardware Ruslan Gilyazov Dreamstime L 114824249 612e53db98b31

    TechXchange: PCB Tools and Technology

    Check out the latest articles covering printed circuit board technology, methodologies, and development tools.
    Georgia Institute of Technology
    Analog

    Graphene-Based Transistors Receive R&D and Mass-Media Attention

    Humble carbon in graphene form is the subject of considerable research effort for non-silicon active devices.
    Intel
    EDA

    Intel Foundry Open to the World

    Intel’s foundry is no longer dedicated to just its own products, but will be available to all customers. And it plans to be the second largest foundry by 2030.
    Multi-Die Systems Set the Stage for Innovation
    EDA

    Multi-Die Systems Set the Stage for Innovation

    Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems.
    91824901 © Forance | Dreamstime.com
    EDA

    EDA Helps Cultivate the Future of Die-to-Die Connectivity

    Explore Keysight’s Chiplet PHY Designer tool and the game-changing UCIe standard in chip design.