3Com, a communications equipment manufacturer, needed a new packaging material to provide ESD protection for its new boards and to reduce cost. The choice was 15-mil-thick Pentastat™ SC Static-Dissipative PETG Film from Kl” ckner Pentaplast, thermoformed by Universal Protective Packaging.
Prior to using Pentastat, 3Com inserted each PCB into an antistatic plastic bag and then into a box lined with antistatic polyurethane foam. That process took three steps, each increasing the chances for static damage.
With Pentastat, the company was able to reduce the number of ESD-protection products and processes to one. This cut packaging time and laid the groundwork for automating the packaging process.
The clear rigid vinyl film has static-dissipative properties consistent on both sides. It meets MIL-B-81705C and EIA-541 requirements for a surface resistivity of <1 ´ 1012 W /sq, and static decay from ± 5,000 V to 50 V in <2 s at 12% relative humidity. The material is formulated for thermoformed clamshells for PCBs and other ESD-sensitive components. Pentastat provides a tensile strength of 6,650 lb/in.2 and has a cold-break temperature of -4° F. The material also meets the outgassing requirements of ASTM-E595-77 and the polycarbonate compatibility stipulations of EIA-564 and SP-2222.
The material is noncontaminating, nontoxic, reusable and recyclable. It is available in thicknesses from 7.5 mils to 30 mils. Certification of electrical properties is provided with every order. Kl” ckner Pentaplast of America, (540) 832-3600.
Copyright 1996 Nelson Publishing Inc.
November 1996
