• Resources
  • Directory
  • Webinars
  • CAD Models
  • Video
  • Blogs
  • Advertise

    • Electronic Design


    COMPANY OVERVIEW

    About Electronic Design

    The premier independent information source for electronics engineers, programmers and designers.

    Contact

    https://electronicdesign.com

    More Info on Electronic Design

    Print and digital editions are available as well as all our articles that appear online.

    Electronic Design is the premier independent information source for electronics engineers that provide must-have, fully comprehensive coverage of the electronics industry through its vast network of experts. Electronic Design covers the technologies required for engineers to make the right design decisions at the right time – quickly & efficiently.

    Our experts cover the full spectrum on products, markets and technologies, from analog and power to embedded and automotive. Every day, we inform and engage engineers and engineering managers with critical content on rapid technological advances and their applications at the component, chip, board, and system levels. We also provide a host of marketing solutions and opportunities to connect with our audience.

    You can contact us if you would like to contribute content for this site. 

    Useful links

    Articles & News

    Chung-Ang University
    ed_interest_koreatransducers_fig1newpromo
    Sensors

    Korean Researchers Advance Piezoelectric and Triboelectric Harvesting Sensors

    Jan. 24, 2025
    Advances in materials science stemming from research in South Korea are leading to higher-performance piezoelectric and triboelectric, and self-powering, sensors.
    Tony Vitolo/Electronic Design
    powerbestlanding
    PowerBites

    2024 PowerBest Award Winners for Power Device, Conversion, and Packaging Products

    Jan. 24, 2025
    Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of...
    Tony Vitolo/Electronic Design
    powerbestnew
    Power

    2024 PowerBest Winners: Passives, Packaging, and Applications

    Jan. 24, 2025
    Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher power densities and frequencies.
    Tony Vitolo/Electronic Design
    powerbestnew
    Power

    2024 PowerBest Winners: Power Conversion and Management

    Jan. 24, 2025
    Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient solutions for EVs, data centers, and other critical applications...
    Tony Vitolo/Electronic Design
    powerbestnew
    Power

    2024 PowerBest Winners: Power Devices

    Jan. 24, 2025
    SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...
    Dreamstime_yuliya_pauliukevich_3328149251
    dreamstime_yuliyapauliukevich_3328149251
    Analog

    Readers’ Choice: The Best Analog Articles of 2024

    Jan. 24, 2025
    The results are in—Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to become contributing authors.

    Videos & Resources

    TEF 2024: Ethernet Evolution: Powering High-Speed AI Connections
    Ethernet

    Ethernet in the Age of AI

    Jan. 23, 2025
    Check out the presentations from the 2024 Technology Exploration Forum.
    Consumer Technology Association (CTA)
    ces25_toptech
    Embedded

    Interesting Stuff from CES 2025

    Jan. 23, 2025
    Check out what Endeavor Business Media editors thought was most interesting at CES 2025.
    Projecting Images into the Eye of the Beholder
    Embedded

    Projecting Images into the Eye of the Beholder

    Jan. 15, 2025
    TDK’s mini-lasers are used to project images directly into the eye.
    SMU Tests Nanoscale & 2D Semiconductor Devices
    Test & Measurement

    SMU Tests Nanoscale and 2D Semiconductor Devices

    Jan. 14, 2025
    Lake Shore Cryotronics' SMU module for its M81-SSM instrument brings laboratory-grade, low-level measurement capabilities to a benchtop instrument.
    ele_adi_thumbnail_1
    Power Protection

    Demonstrating an Intrinsically Safe Advanced PHY Device

    Jan. 13, 2025
    The LT8440 is a power conditioner for intrinsically safe, industrial Ethernet ports in hazardous or explosive environments.
    Addressing the Electronic Component Supply Chain
    Computer-Aided Design

    Streamlining the Electronic Component Supply Chain

    Jan. 10, 2025
    To cope with a challenging supply chain, manufacturers rely on up-to-date, accurate data analysis and information.

    KEY CONTACTS

    Andy Turudic

    Technology Editor, Electronic Design

    Michelle Kopier

    Associate Group Publisher

    William G. Wong

    Senior Content Director - Electronic Design and Microwaves & RF

    James Morra

    Senior Editor

    Cabe Atwell

    Technology Editor, Electronic Design

    Roger Engelke Jr.

    Managing Editor - Electronic Design and Microwaves & RF

    David Maliniak

    MWRF Executive Editor

    Alix Paultre

    Editor-at-Large

    Request More Information

    By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.

    All content from Electronic Design

    ID 312686228 © Ralf Liebhold | Dreamstime.com
    3dfx_dreamstime_l_312686228
    Embedded

    Superfan Looks to Breathe New Life into Decades-Old 3dfx Voodoo Video Card

    Jan. 23, 2025
    The VoodooX Project is the closest 3dfx fans will get to see a new video card from a company that went under two decades ago.
    Arm
    arm_csa_standard_promo_image_web
    Embedded

    Arm Releases First Specification for the Chiplet System Architecture

    Jan. 23, 2025
    The new standard will enable companies to design custom chiplets within a shared interconnect ecosystem.
    ID 23743616 © Paulus Rusyanto | Dreamstime.com
    semiconductor_dreamstime_l_23743616
    Embedded

    The Tech Behind Upskilling the Semiconductor Workforce

    Jan. 22, 2025
    The 2022 CHIPS Act spurred a renaissance moment in the semiconductor industry, threatening to be upended by a significant skills gap. This Q&A looks at what’s being done to remedy...
    ID 330469709 © Nathee Sanbooytho | Dreamstime.com
    microchip_dreamstime_l_330469709
    Power

    Multiphase Controller Fine-Tunes Power for AI Chips in Data Centers

    Jan. 22, 2025
    Inside the latest 16-phase power controller from Alpha and Omega Semiconductor and how it helps feed power-hungry GPUs and other AI chips.
    Dreamstime_ralfpoller_11311390 and Numem
    dreamstime_ralfpoller_11311390
    Embedded

    Numem Previews Edge AI Chiplet-Based Solution at 2025 Chiplet Summit

    Jan. 21, 2025
    The ultra-low-power NuRAM/SmartMem compute-in-memory technology implements MRAM to overcome memory bottlenecks.
    Consumer Technology Association (CTA)®
    accenturekeynote3
    Industry Insights

    Wrapping Up CES 2025

    Jan. 21, 2025
    Editors Cabe Atwell and Bill Wong reminisce about the new tech on display (and behind the scenes) at CES 2025.
    Dreamstime_tashatuvango_77654397
    dreamstime_tashatuvango_77654397
    Industrial

    Better Predictive Maintenance Through Vibration and Thermal Sensing

    Jan. 17, 2025
    Vibration and thermal signatures are crucial toward gaining a deeper understanding of failure modes in process operations and thus are an enabler of a predictive-maintenance strategy...
    Dreamstime_jaroonittiwannapong and Broadcom
    chipprocessor_dreamstime_jaroonittiwannapong_35384
    Embedded

    Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips

    Jan. 16, 2025
    The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
    ID 266446299 © Audioundwerbung | Dreamstime.com
    wirelesscharging_dreamstime_l_266446299
    Automotive

    Speeding Up the Widespread Adoption of Wireless EV Charging

    Jan. 16, 2025
    InductEV and Skien Norway's ENRX have signed an MOU that seeks to establish technical standards and ensure compatibility across the wireless EV charging ecosystem worldwide.