From IoT breakthroughs to energy-harvesting chips, CES 2025 showcased the latest technology that’s set to shape our lives. Here’s a look at some of the tech that stood out at ...
Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of...
Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher power densities and frequencies.
Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient solutions for EVs, data centers, and other critical applications...
SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...