Technologies

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Lake Shore Cryotronics' Source Measure Units Optimized for Testing Emerging Nano/2D Semiconductor Devices.

Test & Measurement

SMU Optimized for Testing Nano/2D Semiconductor Devices

The nRF54L Series of wireless SoCs from Nordic Semiconductor

Trio of New Wireless SoCs Zeroes in on IoT Apps

Focus at SSD slot, type M.2 with support for NVMe, on computer motherboard.

New Memories Making Meaningful Strides

Generative AI in the data center

Could Sagence AI’s Analog Inferencing for GenAI be NVIDIA’s Downfall?

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electronica 2024 Wrap-Up

Peripheral modules with popular form factors

Peripheral Connections for Prototyping

Micro-reactors for AI processing in data centers

Inside Electronics

NANO Nuclear’s 5-MW Electricity Generator in a Shipping Container

Highlights

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Test & Measurement

Arrr! Thar’s Piratin’ ta be Done with Emerson’s Newly Minted NI mioDAQ

On International Talk Like a Pirate Day, Andy covers NI’s new USB-based multichannel data-acquisition instrument, the mioDAQ, suitable for reverse engineering as well as bench...

CAD modeling

Over 3,500 New CAD Models of Interconnect Solutions Arrive to Help Speed Design

SnapMagic and Harwin teamed up to bring a vast array of downloadable CAD models, PCB footprints, and component libraries to engineers.

Mixed-Signal Retimer Helps Deliver 800G Copper Connectivity

112G Mixed-Signal Retimer Helps Deliver 800G Copper Connectivity

Point2 Technology’s P1B121 retimer makes 800G active electrical cabling cost-effective and efficient.

Circuit board design

Electronic Design’s Focus Amid Changing Times

From TechXchanges to Quick Polls, Electronic Design goes all digital all the time.

Learning about SPICE modeling

Modeling on Mondays: SPICE Modeling of Common Active Devices—An Overview (Part 1)

Engineering is all about choosing the best compromise—both for a SPICE model that provides reasonable fidelity and for the tools enabling that model to be employed.

Infineon's new ultra-thin silicon power wafer

Ultra-Thin Silicon Wafers Wring More from Power Electronics

According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.

Recommended

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CXL Standards and Architecture

This TechXchange examines the Compute Express Link (CXL) architecture and standards.

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Addressing Chip Verification Challenges

Integrated circuits go through detailed verification before ever making a real chip, allowing developers to be confident that the chip will work once it's produced.

Solar panels on smart home

What’s the Difference Between Silicon Solar Panels and Emerging Solar-Cell Tech?

PI's 1,700-V InnoMux-2 multi-output power-supply ICs target an array of applications

GaN Process Brings SiC-Level Efficiency to 1,700-V Multi-Output Switcher

Autonomous vehicle navigation and positioning

How RTK Can Help Autonomous Vehicles See the World

Holiday gifts for RF engineers

For Under the Tree: RF Development & Evaluation Kits @ mwrf.com

IO-Link transceiver for the factory floor

Startup Launches IO-Link Transceiver to Connect the Factory Floors of the Future

Orca’s OS2000 leverages the IO-Link standard to enable seamless, bidirectional communication between sensors and industrial control systems in factories.

Renesas-Nidec 8-in-1 proof of conecpt for electric-vehicle E-Axles

“8-in-1” Integration Proof of Concept Targets EV E-Axles

Renesas, in collaboration with Nidec, developed the first “8-in-1” proof of concept for E-Axle systems that will help simplify electric-vehicle design. It controls eight functions...

Wurth's passive components database added to onsemi's power-loss model generator

Collaboration Advances High-Accuracy Virtual Design of Power Apps

A power-loss model generator was updated with passive components to more accurately model designs and accelerate time-to-market.

Cell towers

Tiny Non-Reflective RF Switch Pushes to 50 GHz

Solid-state RF switches continue to advance their performance contour in both electrical specifications and physical size.