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Multimedia SoC Sports AI Acceleration

April 24, 2025
MediaTek’s Dimensity 9400+ brings AI performance to high-end smartphones.

What you’ll learn:

  • What’s inside MediaTek’s Dimensity 9400+?
  • What makes the Dimensity 9400+ stand out?

 

Packing numerous high-performance engines, MediaTek’s Dimensity 9400+ SoC builds on the Dimensity 9400, which includes artificial-intelligence (AI) acceleration of small and large language models (SLMs/LLMs). Its CPU complex is built around Arm’s high-end cores, such as a 3.73-GHz Arm Cortex-X925 core plus three Cortex-X4 and four Cortex-A720 cores linked via a 12-MB L3 cache. The 12-core Immortalis-G925 GPU with display support is designed to provide smartphones with plenty of performance.

The MediaTek NPU 890 supports speculative decoding (SpD+), boosting performance by 20%. The NPU, which can handle compact models like Deepseek-R1-Distill with 1.5-, 7-, and 8-bit support, incorporates Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), and Multi-Token Prediction (MTP) functionality.

Advanced Graphics in the Dimensity 9400+

The graphics support also adds a MediaTek frame rate converter (MFRC) 2.0+ that’s designed to reduce power requirements. The GPU incorporates MediaTek’s Adaptive Gaming Technology (MAGT) 3.0 along with Google’s Android Dynamic Performance Framework (ADPF).

Camera support includes AI augmentation with generative AI telephoto capability. The system has full-range HDR zoom with “smooth zoom switching and sustain target autofocus.” AI is also used for audio focusing of the six 24-bit microphone inputs. Bluetooth audio playback handlets 24-bit data up to 384 kHz.

Dimensity 9400+ Pushes Connectivity Envelope

Because the SoC targets high-performance smartphones, integrating a suite of top-of-the-line communication solutions should be no surprise. It supports Wi-Fi 7 with a five-stream, three-band modem that includes MediaTek’s Xtra Range 3.0, which can extend coverage by an additional 30 meters (see video below).

Dimensity 9400+ handles phone-to-phone direct Bluetooth connections up to 10 km—over 6X further than the Dimensity 9400. It works with GNSS as well as China’s BeiDou satellite navigation system with 33% faster TTFF (time to first fix) even without cellular connectivity.

Of course, 5G connectivity is its main communication subsystem. The chip supports 3GPP Release 17.5 4CC-CA up to 7 Gb/s DL, as well as 5G/4G Dual SIM Dual Active, Dual Data capabilities.

About the Author

William G. Wong | Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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