The TMU-100 Thermal Management System provides manual testing of high-power semiconductor devices. A conduction technique that mixes two streams of fluid at temperature extremes transfers heat to or from a device to speed up thermal response times.
The TMU-100 can be configured for package devices or bare die so the same system can be used for multiple requirements. The thermal operating range is 0°C to 100°C. When the setpoint is reached, the temperature of the DUT is controlled with minimal overshoot.
A temperature sensor that contacts the surface of the package or die is incorporated into the thermal head. The sensor is isolated from the thermal head so only the temperature of the DUT is measured. Under $140,000. Aetrium, (612) 770-2000.
Copyright 1998 Nelson Publishing Inc.
January 1998
