In order to meet the requirements for semiconductor device characterization, today’s test systems require active thermoelectric (TEC) test heads to enable dynamic temperature control. A need for smaller TECs capable of pumping higher flux densities is paramount for today’s ATE systems.
Thin-film thermoelectrics offer the promise for reduced thermal switching times for device characterization and increased product lifetime due to their ability to pump large amounts of heat. Due to their micro-scale design and low thermalmass, thin-film TECs can pump a heat flux of over 100 W/cm2 while offering very fast, millisecond response time for rapid cooling and heating. Independent testing has found that thin-film modules respond a minimum of 2.5 times faster than their bulk thermoelectric counterpart.
