John Wilson

John Wilson joined the Mechanical Analysis Division of Mentor, a Siemens Business, after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. His modeling and design knowledge range from component level to Data Centers and has extensive experience in IC package level test and analysis correlation through his work at Mentor’s Fremont, CA-based Thermal Test Facility. He is currently a technical marketing engineer and the electronics product specialist for Mentor’s Mechanical Analysis Division.