Rozalia Beica

Rozalia Beica is Field CTO Packaging for Rapidus Design Solutions, a builder of advanced logic semiconductors. She provides technical and engineering counsel on advanced packaging for customers and partners worldwide. 

Beica is a distinguished leader in the Semiconductor and Advanced Packaging industry with over 30 years of experience. Her expertise spans across electronic materials, substrates, equipment, device & system manufacturing, and market intelligence. Prior to Rapidus, Beica held executive roles at Applied Materials, AT&S, DuPont, Lam Research, LQDX, Maxim IC, and Yole Développement.

An active industry participant, Beica has authored over 175 presentations and publications, including three book chapters, and led various symposiums, consortia activities, and industry roadmaps. She served on the boards of IEEE EPS, IMAPS, 3DinCites and is currently an Advisory Board Member at IMPACT and Terecircuits. Beica earned an MS in Chemical Engineering from Polytechnic University Timisoara (Romania), an M.Sc. in Management of Technology from KWU (US), and a Global Executive MBA from Instituto de Empresa (Spain).