EMI and Signal Noise Management in Miniature Connector and Cable Systems
Electronic interconnection designs for defense electronics, highly mobile robots, surgical monitoring devices and other embedded systems are rapidly changing. Signal speeds are increasing, and are often crammed into smaller and tighter spaces, and potential signal interference as well as crosstalk can become a technical issue. Instrument-level connections must contribute to ensuring electromagnetic compatibility (EMC), is achieved.
EMC standards specify four levels. Level 1 includes discrete components, level 2 is focused on circuit boards, OEM electronic products are addressed at Level 3, which includes electronic circuitry, power sources, motherboards, and interconnect systems. Cables extending beyond the enclosure should comply to Level 4, depending on the application.
The interconnect designers goal is also to contain any potential electromagnetic interference (EMI) that would confuse the main signal system. Connector and cable shielding is used to attenuate the radiation signals from entering the interconnection, as it bleeds off any conducted noise running on the shielding. Selecting good metal conductivity as well as insulation thickness is important for best cable shielding and back-shell technology.