Intel Labs China has chosen congatec COM Express modules for easy design-in and scalability in its Heterogeneous Extensible Robot Open (HERO) platform. Created to simplify and accelerate the development of next-generation IoT connected service robots.

With congatec’s COM-HPC ecosystem consisting of industrial-grade COMs, application-ready Micro-ATX carrier board and cooling solutions, OEMs can now develop the next generation of future-oriented high-performance embedded and edge computing systems.

With the introduction of Intel Xeon D processors on COM-HPC server-on modules, edge server installations can finally be installed anywhere where massive data throughput is required with the lowest possible latencies.

Learn about the new 12th Gen Intel Core mobile and desktop processors in COM-HPC Size A and C as well as COM Express Type 6 form factors.  Offering major performance gains and improvements for the world of embedded and edge computing systems.

congatec supports customer developments throughout the entire product life cycles. Customers benefit from congatec’s rich experience as a manufacturer of high quality computer modules leading to reduced development time and cost.

Even comparatively small vibrations can impair the functional reliability of the RAM when standard memory modules are used. Applications exposed to high shock and vibrations therefore require more robust designs.

Medical technologies are rapidly advancing, redefining many aspects of patient care. To remain at the forefront of innovation, OEMs and their customers must deliver high-performance edge computing solutions that can process real-time patient data.