As demand for data increases, so does demand for data centers, and thus higher demand for power. Read our company blog to learn how innovative semiconductor design and packaging technologies are improving thermal efficiency in data centers.

Achieve higher power density with the industry’s first eFuse with active current sharing in a small package. Stack any number of devices needed to reach your desired current, optimizing BOM without overdesigning the system.

Improve thermal performance with a 650-V 30-mΩ GaN FET with integrated driver, protection and digital temperature reporting in a top-side cooled package.

Monitor and adjust system parameters and faults in real-time with the industry’s first eFuse with integrated PMBus interface. Stack with the TI’s TPS25985 eFuse to achieve 300-A or higher-current system designs with better thermal performance.

Integrate caps and reduce EMI – A unique approach to capacitor integration allows the LMQ66430 buck converter to reduce power supply size and emissions.

In fact, our power experts are so focused on improving efficiency and size of power components that we’re taking an “all-in” approach to mitigating thermals with compelling design techniques and packaging R&D. Learn more by reading this recent article.

TI is determined to resolve the multiple barriers that stand in the way of achieving greater power density. This comprehensive paper explores how challenges like thermals, power converter losses and more can be overcome.

Watch this short video on increasing thermal performance in your design. We’ll cover the sources of increasing temperatures in systems to the various ways to improve thermal resistance and performance, including PCB design and package technologies.

Read this article to learn how to achieve higher power density server designs with the industry’s highest peak current smallest package eFuse portfolio with active current sharing and more accurate system monitoring and protection.