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    • Nov 8, 2024Power-Density Apps on the Fringe/Liquid-Cooled AI Supercomputers
    Nov 7, 2024Dirt Cheap ASIC Design for Dummies: Part 3/Engineer Gifts: What to Buy?
    Nov 6, 2024Single-Phase Controller or Multiphase Converter?/SiFive's RISC-V HiFive
    Nov 5, 2024Measuring and Modeling EMI/Vertical Power Delivery Comes to AI
    Nov 2, 2024"Supercell" Review: Realistic Tech Rules/GaN Revs Up Power Designs
    Nov 1, 2024Scare Tactics: 10 Halloween DIY Projects/Choose the Right Scope Probe
    Oct 31, 2024Skin-Based Biosensing and Harvesting/Open RTOS APIs Enhance Software Dev
    Oct 30, 2024Boost Density with Power Modules/Validating ECUs via HIL Testing
    Oct 29, 2024Recycling to Reduce Rare-Earth Reliance/Advanced Scope Methods
    Oct 26, 2024SPICE Design Success: Best Practices/Next-Gen Tech in Hurricane Monitoring
    Oct 25, 2024Analog Tech Still Preferred in Many Designs/Magnetic YIG GHz Filter
    Oct 24, 2024AI Trips Up with Language Dialects/Coupled Inductor for High-Transient Apps
    Oct 23, 2024Edge GenAI Needs New Solutions/Fortifying School Cybersecurity
    Oct 22, 202411 Under-the-Radar Engineers with Huge "Hits"/Oracle Adds AT&T APIs to ECP
    Oct 19, 2024AI and Robotics: Rebooting the Workflow/Gate Driver Protects Battery Devices
    Oct 18, 2024Plastic-Packaged Parts Bound for Space/IPD Squeezes into BLDC Drivers
    Oct 17, 20243D Printing Offers Power-Density Edge/School Prize Giveaway Ends Friday
    Oct 16, 2024Undergrads Tackle ASIC Design/Sateliot Adds Nanosatellites for 5G
    Oct 15, 2024What's New in Advanced FPGAs?/MagPack Redefines Power Packaging
    Oct 12, 2024USB Type-C Made Easier with PD Controllers/AI-Assisted Peer Reviews?
    Oct 11, 2024How to Measure IC Input EMI/Crossover Micro's NPU Fuels AI
    Oct 10, 2024Dirt Cheap ASIC Design: Part 2/First Findings from Our Maker Survey
    Oct 9, 2024Rugged PCs Built for AI and IIoT/Samsung's Smart Way Forward
    Oct 8, 2024Magnetic Sensors for All Seasons/7 Air Pollutants Captured by Sensor
    Oct 5, 2024Dockworker Strike: Electronic Supply Chain Impact/Multi-Tb Interconnects
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