Why Intel Wants to Build a New "Silicon Heartland" in Ohio

Jan. 26, 2022

Editors James Morra, David Maliniak, and Robert Schoenberger, along with veteran analyst Jim Handy, discuss Intel's recent announcement of plans to build a massive $20 billion manufacturing site near Columbus, Ohio.

David Maliniak,

James Morra

Related To: Electronic Design

Intel is the most iconic semiconductor maker in the world. But it's no longer the most advanced.

To help regain its chip-making prowess, Intel recently announced a plan to invest at least $20 billion in a manufacturing facility in Ohio, one that could become the world's largest when completed.

The location will be the company's first new U.S. manufacturing site in 40 years when the first two factories start mass-production in 2025. The site will be a vast operation, occupying 1,000 acres to start, with space to build up to eight factories in the future. At an event at the White House with President Biden and Commerce Secretary Gina Raimondo, Intel executives called the Ohio investment the “catalyst for a Silicon Heartland.”

Editors James Morra of Electronic Design, David Maliniak of Microwaves & RF, and Robert Schoenberger of Industry Week, along with Objective Analysis's Jim Handy, discuss the announcement in-depth. They go into the implications for the global chip shortage and how Intel's move could affect the future of advanced chip-making in the U.S. They also address what the stakes are for Intel, which under CEO Pat Gelsinger has pledged more than $100 billion of investments to fuel its recovery plans.

For further reading and viewing, visit:

Intel to Invest $20 Billion in Massive Manufacturing Hub in Ohio

Intel's Manufacturing Chief Talks About Why the Company Chose Ohio

Intel to Invest $20B in Ohio for Chip Plants

Commerce Dept. Sounds Alarm on Scarce Semiconductor Supply

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

About the Author

James Morra | Senior Editor

James Morra is a senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.