Microwave Assemblies Designed for Flexibility for RF Board Interconnects
Times Microwave Systems' recently launched its new InstaBend high-performance microwave assemblies, which offer a preassembled design for interconnects between RF circuit cards, modules, and enclosure panels.
The assemblies are ideal for applications with space constraints, including space flight, thermal vacuum, microwave test, and many other commercial and military applications. The cable can be bent very closely behind the connector without damaging the assembly, thus minimizing the footprint and simplifying cable routing.
What’s more, the InstaBend assemblies provide engineers with significantly reduced lead time compared to competing solutions, with drastically reduced lead times. They come in standard configurations or can be customized to meet user’s requirements.
Solid-State Power Amplifier Designed for EW, Radar Applications
TMD Technologies Limited's announced a new solid-state power amplifier (SSPA) for defense electronic-warfare (EW) and radar applications.
The compact and lightweight PTS10147 operates over the 2- to 6-GHz frequency range with a high power of 100 W (pulsed or CW) and a linear gain of around 60 dB.
The SSPA was designed using gallium-nitride (GaN) high-powered transistors in the output and driver stages, providing the highest power-to-volume ratio in its class. As mentioned, the PTS10147 is ideal for electronic jamming utilizing the wideband power amplifier and can be outfitted in UAVs, drones, and man-portable systems.
New Wi-Fi Filters Enhance the 5-GHz Spectrum
Akoustis Technologies has introduced a pair of new Wi-Fi 6E XBAW filter modules designed for enhanced use of the 5-GHz Wi-Fi spectrum.
The 5.6-GHz filter module covers the entire UNII 1-3 spectrum and provides an additional 80-MHz and 160-MHz channel in UNII 4, while the 6.6 GHz filter module covers the UNII 5-8 spectrum.
The new XBAW 5.6/6.6-GHz coexistence filter modules allow for the use of 7x 80-MHz and 3x 160-MHz channels in the UNII 1-4 spectrum, along with 12x 80-MHz and 6x 160-MHz channels in the UNII 5-8 spectrum. Considering that the 6-GHz portion of the Wi-Fi 6E standard is just beginning to roll out for new networks, this new XBAW coexistence solution allows for an environment of greater capacity in the 5-GHz bands.
MU-MIMO Combo Solutions Designed for Gaming, Audio, Industrial Apps
NXP Semiconductors recently launched its family of 2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions aimed at innovating products in the advanced gaming, audio, industrial, and IoT markets.
The IW62X family is designed to provide increased capacity, efficiency, and performance for next-generation connectivity applications, including smart consumer IoT hubs, wireless speakers, video-enabled smart devices, and augmented- and virtual-reality (AR/VR) devices.
The 2x2 Wi-Fi 6 Dual-Band + Bluetooth solutions provide a significant boost over previous-gen Wi-Fi, with a 4X increase in network capacity and a 2X increase in bandwidth. The BT/BLE radios, on the other hand, support Bluetooth/BLE standards (BLE LR/2Mbps, BLE AoA/AoD, BLE Mesh), independent Bluetooth connections, and operational modes with multiple external devices.
New Modules Provide Longer Range for the Industrial IoT
Laird Connectivity announced the release of its new BL653µ Bluetooth 5.1 module series, which provides longer-range Bluetooth Low Energy (BLE) connectivity in harsh industrial environments.
The series is powered by Nordic’s nRF52833 WLCSP outfitted with a Cortex-M4F processor and Bluetooth 5.1 on the same chip. It also features USB access and provides up to +8-dBm transmit power and up to 5.5 V of power.
Expanding on the connectivity options, the BL653µ series also has hardware support for NFC and 802.15.4 (Thread and Zigbee) if the application is warranted. What’s more, the module supports Bluetooth mesh capabilities, extending communication range in environments that have limited access and temperature ranges of -40 to +105°C.
