Featured this week are several new series of programmable ac and dc power sources that harness the power of silicon carbide (SiC) and a small-form-factor, high-sensitivity global-shutter (GS) CMOS image sensor suited for augmented- and virtual-reality gadgets. You also need to check out a new series of board-to-board (BTB) connectors with a proprietary snap-in biscuit design that allows connector units to be stacked together for higher density. Other highlights include a pair of long-reach, single-pair power-over-Ethernet (SPoE) controller ICs.
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