FPGA Adds Hardened USB Interface for Device Bridging
FPGAs have remained relevant in embedded systems thanks to their rich and robust selection of external interfaces and their ability to bridge between devices that use different I/O standards and protocols using flexible programmable logic.
The CrossLink-NX family from Lattice Semiconductor is specifically designed to bridge the gap between sensors, cameras, displays, and other peripherals and the host processor in a system using hardened IP for a wide range of serial interfaces. Its latest CrossLinkU-NX features—for the first time in an FPGA in its class—a hardened USB 2.0 interface that runs up to 480 Mb/s and USB 3.2 interface that hits up to 5 Gb/s.
The new CrossLinkU-NX also integrates 2.5-Gb/s MIPI D-PHY, 5-Gb/s PCIe, 1.5-Gb/s programmable I/O, and Gigabit Ethernet to support sensor bridging. Its abundant digital-signal-processing (DSP) resources can also be used to process data from sensors, displays, and other devices. Compatible with its Propel and Radiant software tools, Lattice said the CrossLinkU-NX FPGA fits everything in small form factors, ranging from a 4- × 4-mm WLCS package (0.4-mm pitch) to 17- × 17-mm BGA package (0.8-mm pitch).
The use of on-chip flash configuration memory in the CrossLink-NX family enables “instant-on” operation. The fast startup of the embedded FPGAs means that systems can be largely powered down during long standby intervals and then instantly turned on when necessary, saving system power and prolonging battery life. CrossLinkU-NX is based on the same 28-nm, fully depleted silicon-on-insulator (FD-SOI) process technology as Lattice’s other Nexus FPGAs.
