Build, test, and iterate isn't a great way to build a rugged system. Too many variables are involved to take a brute-force approach, especially when it comes to power distribution and thermal issues. Simulation can provide designers with the necessary information to optimize a design for size, weight, power, and cost (SWaP-C) before construction. It can also be useful in optimizing and debugging an existing solution.
This webinar delves into the problems, tools, and simulation solutions available to designers of rugged embedded systems.
Speakers
Ivan Straznicky, P.Eng. CTO and a Technical Fellow Curtiss-Wright Defense Solutions, Ottawa, Ontario, Canada
His responsibilities include leading and supporting advanced technology innovation and initiatives collaboratively and efficiently. Subject matter areas include thermal management, high-speed signal integrity, reliability, hardware and mechanical design, and electronics manufacturing. Ivan has over 35 years of experience in the defense & aerospace electronics industry in manufacturing, engineering, technology, and management.
Henry Fernandes Product Development Engineer Passive Heat Exchangers Group Advanced Cooling Technologies
Mr. Henry Fernandes is a Product Development Engineer of the Passive Heat Exchangers Group. During his time at ACT, Mr. Fernandes has been the project lead for numerous thermal projects spanning multiple industries including rugged systems design. Mr. Fernandes received his B.S. in Mechanical Engineering from Penn State University.
Justin Moll Vice President of Sales & Marketing Pixus Technologies
He has been a sales & marketing management consultant and senior-level manager for embedded computing companies for over 20 years. Justin has chaired various VITA and PICMG committees and served as the Vice President of Marketing for PICMG. His degree is in Business Administration from UC Riverside.
Jeff Tharp Senior Product Manager, Thermal Solutions in Electronics Ansys
Jeff joined Ansys through the Ansoft acquisition as an Application Engineer for HFSS and multiphysics RF applications. He worked in this role for 13 years prior to joining the Product Management team in 2021. On the Product Management team, he manages the thermal and structural tool offerings in the Ansys Electronics Desktop, including Icepak and the Mechanical Thermal and Structural tools.
Host
William Wong Editor of Electronic Design and Senior Content Director Endeavor Business Media
Bill Wong is the Editor of Electronic Design and Senior Content Director. He has a BEE degree from The Georgia Institute of Technology and an MS in Computer Science from Rutgers University.
