• 67fffc4606fbfa0679ad0f2b Electronics

    Assessing Thermomechanical Fatigue of Electronics

    As electronic devices become more powerful and compact, managing heat and mechanical stress is critical to ensuring long-term reliability. In this webinar, experts from AltaSim Technologies will show how multiphysics simulation with COMSOL Multiphysics® can help predict and prevent thermomechanical fatigue in electronic components.
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    Date: June 5, 2025
    Time:     2:00 PM EST / 1:00 PM CST / 11:00 AM PST / 7:00 PM GMT
    Sponsor: COMSOL, Inc.
    Duration:     1 Hour

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    As society increasingly relies on electronics, the demand for powerful devices that are safe and reliable increases as well. These complex electronics generate considerable heat that must be efficiently dissipated to prevent premature component failure. Electronics that experience cyclical variations in temperature may fail due to fatigue cracking initiated and propagated by thermomechanical strains, creating a challenge for thermal management design engineers.

     During the electronics design process, engineers can use multiphysics simulation software to effectively account for the thermal and mechanical response of electrical components. Large strains are produced by mechanical restraints to thermal expansion and contraction, as well as by thermal gradients within the electronics. The heating and cooling of components over time produces a time-varying thermomechanical strain in the electronics. Solder joints, for instance, are highly susceptible to this type of thermomechanical fatigue.

     In this webinar, guest speakers Kyle Koppenhoefer and Joshua Thomas from AltaSim Technologies will demonstrate how multiphysics simulation can be used to predict thermomechanical fatigue in electronic devices. The webinar will feature a live demonstration of the COMSOL Multiphysics® software and include a Q&A session.

    Speakers

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    Kyle C. Koppenhoefer, PhD
    Founder
    AltaSim Technologies

    Kyle Koppenhoefer, founder of AltaSim Technologies, has more than 35 years of experience in computational analysis and engineering. He earned a bachelor’s degree in engineering science and mechanics from Virginia Tech and a master’s and doctorate in civil engineering from the University of Illinois. These degrees equipped him with critical theoretical and analytical skills, while his roles at the Department of Defense and Edison Welding Institute (EWI) honed his technical abilities. In 2002, he founded AltaSim Technologies, leveraging his expertise in complex engineering problems.

    Dr. Koppenhoefer’s leadership and innovative solutions have driven the success of AltaSim to where it is today — a leader in improving product design and manufacturing processes across multiple industries, including medical devices and electronics.

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    Josh Thomas
    Senior Engineer
    AltaSim Technologies

    Josh Thomas is a senior engineer at AltaSim Technologies. He has provided consulting and training support in COMSOL Multiphysics® over the last 10 years. He is a lead instructor in many of AltaSim’s classes and has worked extensively with structural mechanics problems and multiphysics problems involving thermal and structural analysis. Josh received his bachelor’s degree in aerospace engineering and master’s degree in mechanical engineering from The Ohio State University.

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