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IMS 2025 @ Microwaves & RF

June 16, 2025

Check out David Maliniak's coverage of the International Microwave Symposium.

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The 2025 International Microwave Symposium is being held in San Francisco this year. I was able to attend last year but not this year. Luckily, the editor of our sister publication Microwaves & RF, David Maliniak, will be covering the conference. Check out the latest from IMS 2025 along with the daily newsletter.

There will be new content and videos up after the show as well, since it takes time to do justice to the demos David will be filming. In the meantime, here are links to a few new products that we were able to write about before the conference started.

IMS 2025 @ Microwaves & RF

Signal-Source SiP Pairs with mmWave Block Upconverter SiP

Spectrum Control (Booth #927) is unveiling its low-jitter, high-frequency signal source system-in-package (SiP) and 18- to 40-GHz mmWave block upconverter SiP. The stable, high-frequency, signal-source SiP is a complete system of clocks with up to four buffered (or divided) high-frequency clocks paired with synchronous system reference signals for JESD interfaces, as well as one FPGA signal.

RF SOI Platform Promises Next-Gen Monolithic Integration

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pSemi's UltraCMOS+, which is its latest breakthrough in RF silicon-on-insulator (SOI) platform technology. According to the company, is an RF SOI platform will produce pSemi’s next generation of monolithic integration with vast improvements in power handling, linearity, isolation, R_ON, C_OFF, integrated intelligence, and, ultimately, portfolio expansion.

Interconnect Range Serves Rugged Mil/Aero Systems

SV Microwave will showcase its latest interconnect product lines in the Amphenol Corridor (Booth #1127) at IMS 2025. Among them is the company’s NanoRF VITA 67.3 connector system, which is designed for high-density, high-frequency modular embedded systems. The connectors support OpenVPX architectures and SOSA-aligned platforms, featuring rugged blind-mate interfaces that range up to 70 GHz in harsh environments.

Kyocera, R&S to Demonstrate OTA Characterization of mmWave PAAM

Kyocera and Rohde & Schwarz demonstrated the characterization of a mmWave, phased-array antenna aimed at a variety of sensing and communication applications. The demo centers on Rohde’s ATS1800M 5G NR multi-directional mmWave test chamber, designed for over-the-air (OTA) testing with an exceptionally small footprint.

About the Author

William G. Wong | Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form.

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below.

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence.

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.