Darvin Edwards

Darvin
Edwards

Darvin Edwards, TI Fellow, manages the SC Packaging modeling team at Texas Instruments. His team is responsible for electrical, thermal, and thermomechanical analysis of new products and package developments. He received his BS in physics from Arizona State University and holds 20 patents. He also has authored or co-authored over 45 papers, articles, and book chapters and has lectured on thermal challenges, modeling, reliability, electrostatic discharge (ESD), and 3D packaging

Articles
Packaging: A 30-Year Career Retrospective
We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.
Repeating Failed History Fails Designs 2
Knowing what failures are common and how to avoid them can go a long way toward eliminating problems in new designs, reducing the need for respins, improving time-to-market and reducing field return rates.
Great Thermal Design Enhances LED Reliability
LED market penetration will continue to grow as costs decline and efficiencies improve. Thermal design of the LED system will play a vital role in providing reliable operation and in finding the lowest-cost cooling solutions.
Enhance Thermal Performance Through Design And Optimization 1
Two trends are resolving today's thermal issues: self-sensing electronics that throttle device performance and power consumption when they begin to overheat and expertise in the art of system design to optimize thermal performance.
Expect 2012’s Packaging Co-Design Improvements To Continue Into 2013
Each year sees co-design software vendors vying with each other to produce the best tools, innovating with the most improvements, gaining customer mind share, and battling it out with competitors to win more seats and grow their user base. This year was no exception when it comes to improvements made in the co-design battlefield.
Package Interconnects Can Make Or Break Performance
Chip and package designers can select from a bewildering catalog of interconnect technologies. Designers can sort through these many options by understanding the relative merits and demerits of each technology.
PCB Design And Its Impact On Device Reliability 1
Long-term reliability is not only a product of high component quality and conservative design, but also how the printed-circuit board is laid out and how components are mounted on it.
Appropriate Package Technologies Enhance Medical Electronics
Medical electronics impact all of us, from sonograms of our babies to CT scans of broken wrists to a vast array of additional electronic devices designed to improve the quality of our lives
Co-Design Reliability Relies On Sound Validation Approaches
Nowhere does "garbage in, garbage out" apply more than to models and simulation. TI's Darvin Edwards discusses how to ensure that you're validating IC-package co-design models properly against physical measurements.
Take Chip Package Co-Design Modeling From Concept To System Qualification
In the first installment of his column, Demystifying Package Design, TI's Darvin Edwards outlines the complex interactions that make the synergies between an IC and its packaging so difficult to tease out.

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