Rick Downs

Rick
Downs

Rick Downs is Director of Applications at Maxim Integrated. He has authored over 50 articles and application notes and has prepared and delivered many seminars on data acquisition. Before joining Maxim, he held various positions at Burr-Brown, Dallas Semiconductor, and Texas Instruments. He received his BSEE from the University of Arizona and holds four patents. 

Articles
Model Your ADCs In Spice (Part 2)
Practical advice from TI's Rick Downs on using SPICE to model SAR ADCs, illustrated with real examples.
Model Your ADCs In Spice (Part 1)
In the first of a series of articles on SPICE modeling of A-to-Ds, TI's Rick Downs describe techniques for modeling input loading and verifying SAR-based data-acquisition system design.
Do Standards Matter In Evaluating ADCs?

Downs168x144Our flight had just started its descent when the gentleman sitting next to me turned to me and we started talking engineering. (He had seen me reading an engineering periodical.)  My seatmate mentioned that he was a member of the Institute of Electrical and Electronics Engineers (IEEE) and that he had made a personal goal to serve on a standards committee.

Understand The Tradeoffs Of Increasing Resolution By Averaging
How to use Allan Variance to optimize sample size when averaging analog-to-digital converter readings.
With Today’s Design Tools, You Don’t Have To Copy Your Father’s Schematics 2
TI's Rick Downs discusses on-line design tools for analog engineers.
Should You Use Audio ADCs For Precision Applications?
Yes, you can use a cheaper "audio" delta-sigma ADC in a high-precision app, but here are some caveats.
Beware The Aliased Signal!
Primer on Nyquist and aliasing applied to the design of input filters for ADCs.
ENOB Isn’t Always The Best Figure Of Merit
Equivalent Number of Bits (ENOB) can be a misleading metric when evaluating data converters. Here's what to watch out for.
Integration, Lower Costs Drive The Need For System Understanding
TI signal chain applications engineering manager Rick Downs discusses tradeoffs between using separate parts (amp + ADC) in the signal chain and using an integrated part designed for the application. He uses an EEG as a design example.
Understanding the AirPods' Rise
Q&A: What’s New in the Wireless Audio Market? Interview with Jawad Haider, Marvell Semiconductor Read Now
What's New
Electronic Design's Products of the Week By Electronic Design Staff Read Now
Fusing Sensors
TDK Swears by Sensor Fusion in $1.3 Billion Deal for InvenSenseBy James Morra New Products Read Now
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