Compact Embedded Form Factor Suits Ultra-Mobile Apps

Feb. 27, 2008
Targeting next-generation embedded processors using 45-nm technology, the Qseven form factor developed by congatec AG and Seco s.r.l. offers high-performance embedded computing on a board measuring 70 by 70 mm. The new standard allows various processor co

Targeting next-generation embedded processors using 45-nm technology, the Qseven form factor developed by congatec AG and Seco s.r.l. offers high-performance embedded computing on a board measuring 70 by 70 mm. The new standard allows various processor configurations to maximize passive cooling technology.

With a maximum power consumption of 12 W, the form factor will appeal to manufacturers of applications that require fanless operation. If heat dissipation is an issue, a thermal cooling interface will help transfer heat to a cooling solution.

Extensive industry-standard connectivity options include: four PCI Express, two SATA, six USB 2.0, one 1000BaseT Ethernet, two SDIO 8-bit, two LVDS 24 bit, DVO/SDVO (shared), video-input port, high-definition audio, I2C bus, and low pin-count bus. By leveraging the mobile PCI Express module (MXM) connector format, Qseven offers three connector heights, from 4.3 mm to 7.8 mm. The companies said this configuration should make the Qseven platform as simple to integrate as a DIMM memory module.

Typical applications will include automation and DIN rail systems, automotive, and anywhere an ultra-mobile embedded computing system is needed. Vendors are invited to join congatec AG and SECO’s open consortium. The companies plan to release a general specification by the end of April, with a full design guide available by May.

congatec AG
www.congatec.com

Seco s.r.l.
www.seco.it

Sponsored Recommendations

Understanding Thermal Challenges in EV Charging Applications

March 28, 2024
As EVs emerge as the dominant mode of transportation, factors such as battery range and quicker charging rates will play pivotal roles in the global economy.

Board-Mount DC/DC Converters in Medical Applications

March 27, 2024
AC/DC or board-mount DC/DC converters provide power for medical devices. This article explains why isolation might be needed and which safety standards apply.

Use Rugged Multiband Antennas to Solve the Mobile Connectivity Challenge

March 27, 2024
Selecting and using antennas for mobile applications requires attention to electrical, mechanical, and environmental characteristics: TE modules can help.

Out-of-the-box Cellular and Wi-Fi connectivity with AWS IoT ExpressLink

March 27, 2024
This demo shows how to enroll LTE-M and Wi-Fi evaluation boards with AWS IoT Core, set up a Connected Health Solution as well as AWS AT commands and AWS IoT ExpressLink security...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!