Envelope Tracking Mitigates LTE RF Front-End Power Issues (.PDF Download)

Over the last decade, 2G/3G RF front-end designs have evolved to a mature and relatively efficient state, with little innovation over the last few years. Instead, with the rollout of LTE networks on the horizon, the race was on for chip vendors to develop their LTE baseband modem and transceiver chipsets. Today most of the chipset challenges have been addressed, with all the major vendors releasing viable products for the first wave of 4G handsets onto the market.

Register or Sign in below to download the full article in .PDF format, including high resolution graphics and schematics.

Register for Complete Access (Valid Email Required)

2016 salary survey

By registering on Electronic Design now, you'll not only gain access to premium content, you'll also become part of a robust engineering community. Gain access to the complete 2016 Salary & Career Report when you register now.

Joining the Electronic Design community also allows you to:

  • Become a member of a group of exclusive Engineers
  • Participate in Expert and Reader driven Q&A's
  • Start your own conversation by commenting on any article or blog
  • Communicate and network with other Engineers from all over the world
  • Gain access to high-quality content

Already registered? here.
Understanding the AirPods' Rise
Q&A: What’s New in the Wireless Audio Market? Interview with Jawad Haider, Marvell Semiconductor Read Now
What's New
Electronic Design's Products of the Week By Electronic Design Staff Read Now
Fusing Sensors
TDK Swears by Sensor Fusion in $1.3 Billion Deal for InvenSenseBy James Morra New Products Read Now
Search Parts Fast

Search by number or manufacturer

 

powered by:

 

Connect With Us

Sponsored Introduction Continue on to (or wait seconds) ×