Electronica 2010 – Measuring 95 mm x 125 mm, the conga-BE57 COM Express module supports DDR3 ECC SODIMM memory modules and low-power Intel processors. Depending on the app, the module enlists a Celeron U3405 processor (2-MB Cache, 1.07 GHz, total power dissipation of 18W) or a CoreT i7-610E processor (4-MB Cache, 2.53 GHz, total power dissipation of 25W). The module also uses the Mobile HM55 Express Chipset, which provides support for up to 8 GB (1066 MT/s) Dual Channel DDR3 SODIMM ECC memory. An integrated graphics controller supports the Flexible Display Interface. Other features include five PCI Express Lanes, eight USB 2.0 ports, three SATA port, one EIDE interface, and a Gigabit Ethernet interface. Samples are available now and pricing will be available following the Electronica show. CONGATEC INC., San Diego, CA. (760) 635-2600.