Microsemi's new RTG4 development kit provides space designers with an evaluation and development platform for applications such as data transmission, serial connectivity, bus interface and high-speed designs using the RTG4 high-speed signal processing radiation-tolerant FPGA device. The development kit is suited for evaluating and designing for remote sensing space payloads, radar and imaging, and spectrometry in civilian, scientific and commercial applications. Other applications include MSS communication satellites, high altitude aviation, medical electronics and civilian nuclear power plant control. The FPGAs feature a reprogrammable flash configuration offering complete immunity to radiation-induced configuration upsets, support for space applications requiring up to 150,000 logic elements and up to 300 MHz of system performance.
The RTG4 FPGA development kit includes an RT4G150 device in a ceramic package with 1,657 pins, two 1 GB DDR3 SDRAM, 2 GB SPI flash memory, PCIe Gen 1 interface, a pair of SMA connectors, two FMC connectors with HPC/LPC pinout, RJ45 interface for 10/100/1000 Ethernet, USB micro-AB connector, embedded Flashpro5 programmer and external programming header, current measurement test points, and demonstration and lab guides.
The TC7764WBG wireless power receiver IC from Toshiba enables mobile devices to be charged wirelessly as fast as if they were connected to the charger via a cable. Optimized to enable 5 W maximum output power and 95° maximum power conversion efficiency, the new IC can be utilized by wireless charger makers to achieve the performance levels offered by cabled chargers, with added benefits. Wireless charging allows the use of a fully insulated WCSP28 package measuring 2.4 x 3.67 x 0.5 mm that is free of exposed charging ports. A digital control circuit realizes little heat generation and guarantees voltage stabilization during load changes. An integrated loadswitch driver for the external loadswitch allows for bypassing the wireless power function when a USB or AC power source is connected to the mobile device.
To ensure mobile device safety, the IC integrates a protocol authentication circuit for power transfers, foreign object detection functions, UVLO and over voltage detection functions, as well as TSD. The TC7764WBG wireless power receiver is compliant with Qi V.1.1.2 which includes a dedicated specification for smartphones and mobile accessories.
KEMET's M55 module polymer hermetic seal (PHS) capacitor series, which includes the M550 and M551, is designed for mission critical high capacitance and voltage applications and are manufactured by placing T550 or T551 PHS capacitors in parallel. With its robust anode quality, benign failure mode, mechanically robust assembly and epoxy housing, the series of modules are ideal for use in high voltage power management applications such as buck boost converters, filtering, hold-up capacitors, and other high ripple or high in-rush current. The series provides extremely low and stable ESR and enhanced capacitance retention at higher frequencies and low temperatures.
KEMET has qualified the discrete components used in the series to DLA Drawing 13030 to ensure these products are suitable for high reliability telecom, computer, defense and aerospace applications. Discrete parts qualified according to this drawing are available options for the modular capacitance solution. The M551 modular PHS capacitor series offers all of the performance benefits of the M550 series but with an increased temperature rating of 125°C. The M550 modular series is rated at 105°C.
Microchip Technology is now offering a new series within its PIC32MX1/2 32-bit MCU family that features a large 256 KB Flash configuration and 16 KB of RAM in small-footprint packages. The latest additions to the MCU family provides flexibility to applications that need complex algorithms and application code, and they are coupled with Microchip’s comprehensive software and tools for designs in graphics, touch sensing and general-purpose embedded control. Features include: up to 50 MHz/83 DMIPS performance for executing advanced control applications and mTouch capacitive touch sensing; enhanced 8-bit PMP for graphics or external memory; a 10-bit, 1 Msps, 13-channel ADC; support for SPI and I2S serial communications interfaces; and USB device/host/OTG functionality.
MPLAB Harmony software development framework integrates the license, resale and support of Microchip and third-party middleware, drivers, libraries and RTOS. Specifically, readily available software packages, including USB stacks and Graphics and Touch libraries, can aid in the development of applications such as consumer, industrial and general-purpose embedded control. Designers seeking to launch consumer products with capacitive touch screens, touch buttons or sliders, as well as USB device/host/OTG connectivity, can benefit from the functionality of the PIC32MX1/2 series of MCUs.
Crystek Microwave's CRFS75-2500 2.5 GHz phase locked clock source with internal reference uses proprietary circuitry and SAW resonator technology to provide ultra-low jitter/phase noise performance with true SineWave output. The resulting clock source exhibits a -105 dBc/Hz phase noise at 10 KHz offset and a noise floor of -167 dBc/Hz. The new device generates a true-sinewave with +5 dBm min. output power from its 5 Vdc input voltage. The clock source has no sub-harmonics and second harmonic is -20 dBc typical. Frequency stability is rated at +/- 25 ppm within an operating temperature range of -20°C to +70°C.
The CRFS75-2500 phase locked clock source comes in a 0.75" x 0.75" SMT package. Applications for the clock source include A/D converters, system clocks for network clock generators/synchronizers, clocks for DDS, test and measurement, avionics, point-to-point radios, and multi-point radios.
Lauterbach is now supporting Spansion HyperFlash memory with its TRACE32 development tools. The HyperBus interface was introduced by Spansion in 2014 as an improvement on low pin count memory interfaces and has been implemented by many SoC manufacturers. HyperFlash memory is based on the HyperBus interface and provides important characteristics such as low latency, high read throughput and space efficiency.
TRACE32, a set of modular microprocessor development tools providing integrated debug environments for embedded designs, now supports HyperFlash memory with the intuitive, fast and flexible Flash programming feature which also provides the user with control of reading, displaying and erasing the content of the flash memory. The content is displayed in a standard hex dump which allows the contents to be readily checked. The TRACE32 development tool supports the pairing of HyperFlash memory with the HyperBus interface and also with the ordinary Quad SPI controller.
Janz Tec's new emPC-A/RPI is a compact, fanless embedded controller based on the Raspberry Pi 2 B board with add-ons to implement additional features needed for industrial applications. Intended for wall or DIN-rail mount, the embedded controller includes extra features that expand the usefulness of the Raspberry Pi computer, including a CANbus interface. The compact 24-pin multi-connector provides access to many of the controllers interfaces such as SPI, I2C, 8 x digital I/O lines, RS232/485, etc. Two USB interfaces are also available on the connector panel. The 4.0" x 3.8" x 1.2", 0.9 lb controller is powered by a 900 MHz quad-core ARM Cortex-A7 BCM2836 processor with 1 GB SDRAM. Built-in interfaces include HDMI graphics, 10/100 Mbit/s Ethernet, 4 x USB 2.0, Micro SDcard socket, CAN, serial debug (9-pin D-SUB), an RS232/485 Serial port, RTC with battery backup, 4 x digital outputs, and 4 x digital inputs (isolated from logic).
The controller comes standard with pre-installed Raspbian operating system software, but a Raspbian-compatible driver package is also optionally available to enable additional features of the emPC-A/RPI such as RTC, CAN, RS232/RS485 and use of CODESYS runtime control system software. The emPC-A/RPI embedded controller is available now from Saelig, Janz Tec’s authorized North American distributor.
The EFM8SB1 Sleepy Bee Silicon Labs EFM8SB1 Sleepy Bee MCUs are Silicon Labs' most energy-friendly 8-bit devices featuring 50 nA sleep mode power (with full memory retention and brown-out detection) and a 2 µs wake-up time. Core speeds scale up to 25 MHz and flash sizes range from 2 to 8 kB. The integrated capacitive sense controller offers an ultra-low-power < 1 µA wake-on-touch capability and 12 robust capacitive touch channels, eliminating the need for on/off switches in many space-sensitive products such as wearables, remote controls, Bluetooth accessories and eReaders, as well as industrial automation, home automation and office equipment.
Available in a 1.78 x 1.66 mm WLCSP, the devices are one-fourth the size of 8-bit MCUs in conventional QFN packages. The MCUs are ideally suited for touch-based, battery-powered and space-constrained IoT and industrial applications requiring long battery lifetimes and energy-efficient human interfaces. The EFM8SB1 Sleepy Bee MCUs also support touch-sense interface design with Silicon Labs' Capacitive Sense Profiler and Library available within the Simplicity Studio development platform. Patented crossbar technology offers a range of analog and digital peripherals including a high-resolution CDC, a 12-bit ADC, high-performance timers, and enhanced SPI, I2C and UART serial ports.
Keystone's RJ45, a new series of advanced 8P8C modular jacks, are suited for 100Base-T Fast Ethernet applications to support the high-speed performance requirements of GbE applications. Manufactured for increased durability, the sockets can endure a minimum of 500 insertion cycles, and rated for 125 VAC RMS, the jacks are fully compliant with IEEE and IEC standards. A variety of styles are available to accommodate design applications with numerous mounting and port size options.
Horizontal (right-angle) PCB modular jacks are available in thru-hole or SMT soldering configurations and a variety of styles are offered to accommodate design applications with numerous mounting and port size options, including: cat. no. 943 for low profile applications; cat. no. 942 for compact designs; cat. no. 948 for applications requiring a deeper socket; cat. No. 944 for SMT installation designs; cat. No 949 – a vertical (top-entry) PCB modular jack for devices where connectivity will be perpendicular-to-the-board; and cat. no. 946 which is supplied in a 2-piece locking design to simplify and secure wiring of the jack for panel mounting.
Billed as the first true hybrid temperature chamber/platform combination, the Hybrid Benchtop Chamber from TotalTemp combines many of the benefits of temperature chambers and thermal platforms into one compact unit in order to maximize performance and control in thermal testing. The hybrid's enhanced performance features include increased throughput with faster cycle times, improved thermal gradients, superior thermal uniformity, and temperature ranges from –100°C to +150°C. The floor of the chamber serves as a completely functioning Hot/Cold Plate, independent or simultaneous with the chamber.
In the basic operation mode, the new unit demonstrates a significant improvement in thermal test performance. The fully featured Synergy Nano temperature controller is capable of controlling platform temperature and air temperature independently or together. The controller is capable of advanced temperature control algorithms and can allow even better performance by monitoring DUT temperature and allowing air and platform temperatures to be carefully controlled while verifying that required DUT temperatures are achieved.
Whether you're looking for MCUs or dev kits, Electronic Design has you covered. We've rounded up some of the latest products to help optimize your applications, devices, and systems.
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