• Apr 2, 2014

    MIPI Physical Layer Transmitter Test Solutions

    Live Webinar: April 2, 2014 at 1 p.m. ET / 10 a.m. PT | New physical standards are being developed by Mobile Industry Processor Interface (MIPI) Alliance standards body, which standardizes interfaces for mobile applications and designs. Additional capabilities and data rate extensions will be added to the existing D-PHY and M-PHY specifications to push the performance envelope. A new C-PHY specification will also be created, which is based on a new 3-wire multi-level signaling scheme to achieve higher performance through higher bits/symbol. If you are developing or validating the transmitters of these new MIPI physical layers, you'll want to attend this webcast to understand the new test challenges as well as the solutions....More
  • Mar 27, 2014

    Simulation-Measurement Workflow for DDR Compliance

    Live Webinar: March 27, 2014 at 1 p.m. ET / 10 a.m. PT | This webcast discusses Agilent DDR3 and DDR4 compliance test applications using both pre-silicon simulated waveforms and post-silicon measured waveforms, with emphasis on correlating simulation with measurement. We will describe a methodology for simulating the full path from memory controller to DRAM solder ball. A simulation-measurement correlation methodology called “Waveform Bridge” is discussed where DQ and DQS waveforms in both pre-layout and post-layout simulations are used to feed a DDR compliance test app....More
  • Mar 12, 2014

    Do You Have What it Takes to Test HDMI 2.0?

    Live Webinar: March 12, 2014 at 1 p.m. ET/10am PT | In this webcast, we will provide an HDMI 2.0 technical overview as well as cover the latest physical layer testing requirements for HDMI 2.0 as well as the previous specification (HDMI 1.4b). Join us to learn about the new testing requirements and what it takes to stay ahead of HDMI physical layer testing challenges....More
  • Feb 19, 2014

    SFP+ and 10GBASE-KR Transmitter Compliance Using Real-time and Sampling Oscilloscopes

    As cloud computing and data centers expand more and more network hardware will need to be interconnected through fiber and backplane connections. The SFF-8431 and IEEE 802.3ap specifications keep these technologies humming through tight tolerances that are required from all SFP+ and 10GBASE-KR applications....More
  • Feb 27, 2014

    Endless Application Possibilities with Near Field Communication (NFC)

    Live Webinar: February 27, 2014 at 10 a.m. ET/ 7 a.m. PT | Gone are the days of setting up wireless connectivity manually. Near Field Communication (NFC) technology is taking off, and the proliferation of smart phones, tablets and notebooks is driving the integration of NFC into many other end products and devices. These applications include contactless, mobile payments; Bluetooth / Wi-Fi device pairing; and advanced sensor transponders which communicate through NFC....More
  • Mar 4, 2014

    Accelerate DDR4/LPDDR3 Memory Debug with Bus level Signal Integrity Insight

    Live Webinar: March 4, 2014 at 1 p.m. ET/10am PT | High-speed DDR4/LPDDR3 memory designs offer new challenges and increased complexity. Learn about time-saving memory debug and validation techniques using a logic analyzer. Understand how to gain bus level signal integrity insight by interpreting eye scans. Increased insight allows you to make your memory debug go faster and smoother....More
  • Jan 23, 2014

    Fixture De-embedding Techniques for 28 Gb/s Transmitter Measurements

    Live Webinar: January 23, 2014 at 1 p.m. ET/10am PT | Gone are the days when IC pins were accessible and when bit rates were low enough that the probe loading was negligible. Today’s high density BGA packages and multi-gigabit/s data rates present twin challenges to signal integrity engineers who want to measure the eye diagram at the IC solder bump....More
  • Jan 9, 2014

    The Fundamentals of Fast Pulsed IV Measurement

    Live Webinar: January 9, 2014 at 1 p.m. ET | In this webcast Agilent Technologies will cover all of the basics of fast pulsed IV measurement including: • An overview of pulsed measurement solution options • The pros and cons of DC probes versus RF probes for on-wafer measurement • Proper structure design practices to optimize on-wafer measurements • General tips and tricks to improve high-speed measurement results • Examples of high-speed IV measurement applications (NBTI/PBTI, RTS noise, etc....More
  • Dec 12, 2013

    From Design to Development: Launch your Product with the Expanded TI LaunchPad Ecosystem

    Live Webinar: December 12, 2013 at 2 p.m. EST | The MCU LaunchPad Evaluation Platform & Ecosystem is TI’s solution for all of your maker and developer needs. Register now to gain an exclusive sneak peek into the future of the LaunchPad ecosystem!...More
  • Nov 21, 2013

    Leverage SECO’s Production-Ready Qseven System-on-Module to Unleash Freescale’s i.MX 6 Series Processor Multimedia Potential

    Live Webinar: November 21, 2013 at 10 a.m. EST | Designers understand the effort involved to write driver software, connect memory and synchronize power circuits for highly-integrated applications processors. The good news is that SECO and Freescale have done much of the legwork for you, helping you jump start your project....More

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