• Nov 18, 2014

    Switch Mode Power Supply Measurements and Analysis using Oscilloscopes

    Learn how to gain greater insight into the performance and efficiency of switch mode power supplies using oscilloscopes....More
  • Nov 12, 2014

    Ten Oscilloscope Innovations You’ll Want that Didn’t Exist Three Years Ago

    Human interface design of modern electronics have dramatically improved to increase productivity. In parallel, oscilloscope user interfaces have had radical improvements to speed debug and analysis....More
  • Oct 29, 2014

    The Industrial IOT: CPUS, Systems, Standards and Cloud Computing

    Intel's addition of a low power System-on-Chip and even smaller-sized Intel® Quark™ technology to their better known high performance processor lines has created a sweet spot for embedded developers to incorporate x86 designs into today’s mobile, portable, connected systems....More
  • Oct 23, 2014

    PAM-4 Solutions for Transmit and Receive Design Characterization

    400 Gb/s links will be the next step in the continuing need for increased network bandwidth in data centers. Multi-level signaling formats such as PAM-4 are an enabling technology to implement 400G....More
  • Sep 30, 2014

    MIPI M-PHY, D-PHY and C-PHY Receiver Testing - Today and Tomorrow

    The mobile industry benefits from standards for hardware and software interfaces for mobile devices established by the MIPI Alliance. Data rate extensions of existing D-PHY and M-PHY interfaces, as well as the recently published multiple bit/symbol C-PHY interface, meet demands for higher aggregate bandwidth....More
  • Oct 16, 2014

    Innovative Battery and Power Management Solutions for Wearable Electronics

    Wearable technology is poised for major growth. This technology can take many forms from fitness bands and smartwatches to augmented reality visors and more. Many of today’s consumer products are oriented toward health and fitness, convenience, or smartphone accessories but there are medical, safety, and security applications for enterprise and professional use, as well....More
  • Oct 30, 2014

    SuperSpeed USB 10Gbps (USB 3.1) Physical Layer Test Challenges

    Driven by the demand for more bandwidth, high speed digital standards continues to evolve to higher data rates. The USB 3.1 specification delivers more than double the practical data rate compared to the current 5 Gbps USB 3.0, by implementing a more efficient data encoding scheme. This results in even tougher requirements for the physical layer to ensure interoperability at 10 Gbps....More
  • Oct 1, 2014

    Surmounting the Challenges of 16 Gigabit Operation with PCI Express

    The move to data transfer speeds of 8 gigabits per second and beyond ushered in a new era for PCI Express designers who had to overcome the physical test challenges of receiver equalization and complicated feedback mechanisms for controlling transmitter equalization. In addition shorter unit intervals and channel insertion loss reduce operating margins considerably....More
  • Aug 28, 2014

    How to Achieve Compliance to the New 1E-16 BER Contour Spec in DDR4

    For the first time in a DDR standard, JEDEC has included in a BER contour spec for DDR4. The eye opening of the 1E-16 BER contour of DQ lines must not violate the mask. This specification presents new simulation and measurement challenges....More
  • Oct 29, 2014

    Measuring Power Rail Signal Integrity with Oscilloscopes

    Power rails play a critical part in today’s electronic device development. The need to see and characterize small disturbances on rails is increasing as are the challenges to make these measurements. Attend the webinar and learn what scope attributes—from the acquisition engine to the probe tip—enable more precise and comprehensive testing of power rails....More

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