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The future of embedded apps. Unlocked by Intel's
newest designs.
A new world of innovative, potentially life-changing embedded applications is right around the corner. Only with Intel's faster, cooler, smaller designs. Check out the possibilities. FEATURES Engineering Feature · By Terry Costlow, Contributing Editor
PACs Become Task Masters
Faster speeds and greater memory make it easier to integrate many functions in one system using programmable automation controllers. Technology Report · By Mat Dirjish, Components/Interconnects/Packaging Editor
Ultracapacitors Branch Out Into Wider Markets
Known for their muscle, these devices are scaling back in size but not in power to provide juice for a broader range of devices—including portables. Engineering Essentials · By Don Tuite, Analog/Power Editor
Challenges Lie Ahead At The Physical Layer
High-speed serial data has all but replaced parallel buses, but it's getting tougher to ramp up the throughput. Design Solution · By Paul Franklin, LXI Consortium
Get Started On Your LXI-Compliant Instrument Design
Whether the device falls into Class A, B, or C compliancy, a number of decisions must be made before the design process begins.
A new world of innovative, potentially life-changing embedded applications is right around the corner. Only with Intel's faster, cooler, smaller designs. Check out the possibilities. FEATURES Engineering Feature · By Terry Costlow, Contributing Editor
PACs Become Task Masters
Faster speeds and greater memory make it easier to integrate many functions in one system using programmable automation controllers. Technology Report · By Mat Dirjish, Components/Interconnects/Packaging Editor
Ultracapacitors Branch Out Into Wider Markets
Known for their muscle, these devices are scaling back in size but not in power to provide juice for a broader range of devices—including portables. Engineering Essentials · By Don Tuite, Analog/Power Editor
Challenges Lie Ahead At The Physical Layer
High-speed serial data has all but replaced parallel buses, but it's getting tougher to ramp up the throughput. Design Solution · By Paul Franklin, LXI Consortium
Get Started On Your LXI-Compliant Instrument Design
Whether the device falls into Class A, B, or C compliancy, a number of decisions must be made before the design process begins.
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IDEAS for DESIGN
By Tom Bruhns, Agilent Technologies Inc.
Using Copper Traces As Ballast Resistors Ensures Balance
By Shyam Sunder Tiwari, Sensors Technology Private Ltd.
Superior JFET Biasing Improves Amplifier Performance
By Dennis Myer, Nova Scotia Community College
Rotating LED Array Emulates Marquee-Type Display
TECHVIEW Leapfrog · By Don Tuite, Analog/Power Editor
Stack Monitor Chips Without Isolation Concerns To Give Your Electric Car Some Zip
EDA · By David Maliniak, EDA Editor
Custom Sources Light Way To 22-nm IC Lithography
Analog & Power · By Don Tuite, Analog/Power Editor
Fast ADC Sips Power, Simplifies Design-In
EEPN in ELECTRONIC DESIGN From The Editor · By Mat Dirjish, Packaging/Optoelectronics Editor
Hairy Gecko Peds Hold Key To Powerful Dry Adhesives
From The Industry · By Stephen J. Whitney, Littelfuse Inc.
Select The Right Circuit Protection For Switch-Mode Power Supplies
COLUMNS Editorial · By Joe Desposito, Editor-in-Chief
The Very Old And Very New Converge At Belgium’s IMEC
Point Of View · By Joe Shapiro, National Instruments
Are Designers Making Multicore More Complicated? Or Less?
Point Of View · By Joe Shapiro, National Instruments
PACs Address Increasing Green Monitoring Requirements
Pease Porridge · By Bob Pease
Bob's Mailbox
Using Copper Traces As Ballast Resistors Ensures Balance
By Shyam Sunder Tiwari, Sensors Technology Private Ltd.
Superior JFET Biasing Improves Amplifier Performance
By Dennis Myer, Nova Scotia Community College
Rotating LED Array Emulates Marquee-Type Display
TECHVIEW Leapfrog · By Don Tuite, Analog/Power Editor
Stack Monitor Chips Without Isolation Concerns To Give Your Electric Car Some Zip
EDA · By David Maliniak, EDA Editor
Custom Sources Light Way To 22-nm IC Lithography
Analog & Power · By Don Tuite, Analog/Power Editor
Fast ADC Sips Power, Simplifies Design-In
EEPN in ELECTRONIC DESIGN From The Editor · By Mat Dirjish, Packaging/Optoelectronics Editor
Hairy Gecko Peds Hold Key To Powerful Dry Adhesives
From The Industry · By Stephen J. Whitney, Littelfuse Inc.
Select The Right Circuit Protection For Switch-Mode Power Supplies
COLUMNS Editorial · By Joe Desposito, Editor-in-Chief
The Very Old And Very New Converge At Belgium’s IMEC
Point Of View · By Joe Shapiro, National Instruments
Are Designers Making Multicore More Complicated? Or Less?
Point Of View · By Joe Shapiro, National Instruments
PACs Address Increasing Green Monitoring Requirements
Pease Porridge · By Bob Pease
Bob's Mailbox