47542605 © Nmedia | Dreamstime.com
Infineon Promo

Processor Boot Solution Addresses High-Rel Edge Space Systems

July 14, 2023
Teledyne e2v and Infineon will join forces on an optimized processor boot solution for compute-intensive space systems.

Infineon Technologies and Teledyne e2v created a reference design that supports the implementation of compute-intensive mil/aero and civilian space systems. Based on Teledyne e2v's QLS1046-Space edge-computing module, the design leverages the radiation-hardened 64-MB Infineon SONOS-based NOR flash memory. The reference design targets the weight and communication limitations of these systems by reducing the number of components and enabling AI computation at the edge to decrease latency and overcome communication restrictions.

The edge-computing module leverages a 64-bit quad Arm Cortex-A72 processor that has an integrated 4-GB DDR4 memory. It requires a non-volatile memory for boot-up, which is addressed by the robust radiation-hardened SONOS-based Infineon CYRS17B512 non-volatile memory.

Highly optimized for processor boot-up and FPGA configuration, the memory’s QSPI bus can directly connect to the QLS1046-Space, removing the need for a voltage translator. Offering high radiation resilience, the QLS1046-Space and CYRS17B512 increase safety and operational lifetime once deployed, with a 100-krad total-ionizing-dose (TID) rating and a 60 MeV.cm2/mg single-event latch-up (SEL) immunity.

“By collaborating with valued technology partners like Infineon, we are successfully establishing a product ecosystem around our renowned Qormino edge-computing module,” said Thomas Porchez, Application Engineer at Teledyne e2v. “The new reference design makes it much easier for space system designers, allowing them to keep everything on schedule and within budget, while reducing engineering effort.”

“Our CYRS17B512 NOR flash memory and Teledyne e2v’s QLS1046-Space processor module are well-suited to work together in demanding space designs,” said Helmut Puchner, Vice President & Fellow at Infineon’s Memory Solutions Aerospace & Defense. “We expect to see a lot of market interest in the reference design with these two key components, which are necessary to provide a solid space solution for high-performance computing applications.”

Related lnks:

Infineon Technologies

Teledyne e2v QLS1046-Space edge-computing module

Infineon SONOS based NOR Flash memory

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!