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  • Chip Packaging

    • Chip Packaging

    This TechXchange examines chip packaging technology including new advances such as chiplets.
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    EDA

    Through the Substrate Looking Glass

    Oct. 19, 2023
    Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.
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    Chip Packaging Part 1 - Traditional Packaging Technology

    Feb. 19, 2021
    Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods
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    Chip Packaging Part 2 - Introduction to IC Packaging

    Feb. 13, 2021
    Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)
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    Chip Packaging Part 3 - Silicon Interposer

    Feb. 12, 2021
    Dr. Navid Asadi’s group examines how silicon interposers are changing chip packaging
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    Chip Packaging Part 4 - 2.5D and 3D Packaging

    Feb. 11, 2021
    Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions

    More content from Chip Packaging

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    Chip Packaging Part 5 - Chip Production and Manufacturing

    Feb. 8, 2021
    Dr. Navid Asadi’s group examines chip package production
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    Chip Packaging Part 6 - Wafer to Panel Level Packaging

    Feb. 4, 2021
    Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.
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    Packaging: A 30-Year Career Retrospective

    Nov. 4, 2013
    We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.
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    Digital ICs

    Advanced Packaging Delivers Capacity And Performance

    June 20, 2013
    High-density BGAs and 3D stacking increase compute and storage density.