• Home >
  • Back Issues >
  • TechXchange >
  • Chip Packaging

    • Chip Packaging

    This TechXchange examines chip packaging technology including new advances such as chiplets.
    Maxresdefault 65303d64c15e8
    Oct. 19, 2023
    Intel is looking to use glass, which has strong thermal and mechanical characteristics, as a substrate for chiplets.
    Chip Packaging Part1 Promo
    Feb. 19, 2021
    Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods
    Chip Packaging Part2 Promo
    Feb. 13, 2021
    Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)
    Chip Packaging Part3 Promo
    Feb. 12, 2021
    Dr. Navid Asadi’s group examines how silicon interposers are changing chip packaging
    Chip Packaging Part4 Promo
    Feb. 11, 2021
    Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions

    More content from Chip Packaging

    Chip Packaging Part5 Promo
    Feb. 8, 2021
    Dr. Navid Asadi’s group examines chip package production
    Dreamstime 177838367
    Feb. 4, 2021
    Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.
    Image
    Nov. 4, 2013
    We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.
    Image
    June 20, 2013
    High-density BGAs and 3D stacking increase compute and storage density.