The world of electronics is undergoing a transformational shift driven by the relentless push for miniaturization. As the demand for smaller, more powerful, and feature-rich devices surges, printed circuit boards (PCBs) continue to evolve dramatically in terms of miniaturization to enable such high-density integration.
However, with miniaturization comes unique design and manufacturing challenges that require creative solutions. This article examines the miniaturization trends of PCBs and the top five challenges introduced by miniaturization in PCB assembly.