5 Practical Strategies to Address PCB Miniaturization Challenges (Download)

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In Part 1, “Top 5 Challenges in PCB Assembly,” we examined the five main challenges facing PCB designers. These include signal integrity and thermal management, bare-board production, PCB assembly and placement, advanced materials and smaller components, plus rework and repair.

While these challenges are daunting, they can be mitigated with systematic planning, optimized designs, advanced processes, quality control, and expertise in PCB design, manufacturing, and assembly. What follows are five strategies often used to deal with miniaturization issues in PCB assembly.