June 23, 2025 - Electronic Design Today

TE Connectivity’s Matt McAlonis discusses how engineers can use the “follow-the-wire” approach to enhance connectivity in eVTOL aircraft.

Top trends this month: Bidirectional power conversion is now “a thing,” power innovations accelerate the evolution of EV body electronics, and Nixie Tubes are cool again.

Integrating a shunt resistor and Hall-based current sensor into a single device helps simplify EV architectures and enhances safety.

Find out why radial-flux electric motors are becoming more important, especially with the rise of their axial-flux counterparts.

Understanding the magnetic materials inside devices like chokes and transformers can help guide engineers to make smart selections that lead to significantly higher power density...

Silicon photonics is rewiring the future of data centers. But engineers need more advanced simulation tools to integrate these light-slinging components with electronics.

MIKROE’s Nixie Power Click add-on board and Nixie shield deliver the “retro” look for visually striking and nostalgic projects.

Flexible, stretchable electrodes give more degrees of freedom to battery design-in.

Infineon’s integrated system power controller, housed in a small SMD package, is aimed at appliances and AI servers.

From supercomputers with millions of cores to holograms the size of a fish tank, take a look at some of the largest and most ambitious electronics ever built.

Satellite drift might not sound like a problem, but it’s a real-world issue that affects everything from your GPS to emergency communications, and engineers have some clever tricks...

Alpha and Omega’s dual-output eight-phase controller provides a complete power-management solution for AMD AM5 desktop and Navi44/48 graphics platforms.

TI's TMS320F28P550SJ MCU with an integrated neural processing unit is designed to run CNN models to help reduce latency and power usage.

This high-voltage op amp developed by Analog Devices includes an SPI-accessible digital engine for alarms and thresholds.

TeraSignal's TS9802 Intelligent TIA incorporates diagnostics without a DSP.

By upgrading to the 3-nm process, Marvell is positioning the new Ara DSP to be a key building block of 1.6-Tb/s optical modules in the data center.

The new C-PHY v3.0 specification will foster next-generation imaging sensor innovation for everything from mobile devices to transportation.