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    1. Electronic Design

    Highly Parallel Wafer-Level-Reliability Systems with Modular SMUs (.PDF Download)

    Oct. 31, 2016

    Reliability testing has long served as a method of ensuring that semiconductor devices maintain their desired performance over a given lifetime. As IC manufacturers continue to introduce new and innovative processes with decreasing device geometries, they need to ensure that the additional complexity from these changes doesn’t affect the long-term reliability of their ICs. In addition, major technology trends in autonomous driving, cloud-based data storage, and life sciences are forcing IC suppliers to provide higher assurances of product reliability to their customers who work on mission-critical applications...

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    Same Sky Solutions—Select a Fan for Forced Air Cooling

    This presentation will provide an overview on proper fan selection, including system profiling, determining a system’s cooling requirements, and an outline of fan types and features...

    How sensor fusion is driving vehicle autonomy forward

    As ADAS technology extends to critical, time-sensitive applications such as emergency braking, front-collision warning and avoidance, and blind-spot detection combining data...

    The Basics of Ultrasonic Sensors

    This video delves into the basics of ultrasonic sensors, including how they work, understanding beam angles, a comparison of strengths and limitations, and more.

    High-end corner radar reference design

    View the TI TIDEP-01027 reference design block diagram, schematic, bill of materials (BOM), description, features and design files and start designing.