Key Features
- No mixing, convenient handling
- Cures at 185°F
- Used as a barrier to block flow
- Thermally conductive, electrically isolating
- Paste consistency, but easy to dispense from a syringe
- Requires low heat cure of 85°C for 2-3 hours
- Thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m·K)]
- Shore D hardness of 75-85
- Serviceable from -100°F to +350°F [-73°C to +177°C]
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. Forumlated to serve as a damming compound, the thixotropic paste material can also be utilized for bonding and sealing. The material cures in place and will not run or slump, making it ideal for applications where no flow is needed.
The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive.
“Supreme 3DM-85 is designed for heat-sensitive components that cannot withstand high temperatures for curing. The fact that it is not premixed and frozen gives it an advantage in production situations where freezer storage may not be practical. Also, there are no special shipping requirements,” says Senior Product Engineer Rohit Ramnath.
As a toughened system, Supreme 3DM-85 resists rigorous thermal cycling. It is important to facilitate heat dissipation and prevent overheating, especially in densely packed electronic assemblies.
Supreme 3DM-85 forms strong bonds with an extensive range of substrates commonly found in electronics and semiconductors. Substrates include metals, composites, ceramics, silicon, and a wide array of plastics. As a single-part system, it is easy to handle and offers unlimited working life at room temperature. It is opaque black in color and can be applied manually or automatically for use in syringes and jars.