Master Bond EP3HTSDA-2
Adhesives

Master Bond EP3HTSDA-2

One component epoxy system featuring excellent electrical and thermal conductivity
Master Bond
Master Bond EP3UF-1
Adhesives

Master Bond EP3UF-1

One component epoxy for bonding and underfill applications
Master Bond Ep4 En 80
Adhesives

Master Bond EP4EN-80

One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C
Master Bond
Master Bond Master Sil153 Ao
Adhesives

Master Bond MasterSil 153AO

Two part thermally conductive, electrically insulating silicone for bonding and sealing
Masterbond Ep40tc
Adhesives

Master Bond EP40TC

Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing
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Avishtech

With our industry-leading Gauss suite of printed-circuit simulation, design, and development software, and our exciting projects in the pipeline, Avishtech is your guide, your...