• Masterbond Ep4s80
    One component, silver-filled epoxy with a curing temperature of 80°C
    Master Bond
    Master Bond EP17HTND-CCM
    One component, high temperature resistant epoxy system for bonding and sealing
    Master Bond EP3HTSDA-2
    One component epoxy system featuring excellent electrical and thermal conductivity
    Master Bond
    Master Bond EP3UF-1
    One component epoxy for bonding and underfill applications
    Master Bond Ep4 En 80
    One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C
    Dow Logo
    With a broad portfolio of electronics materials and global technical expertise, we are ready to deliver on today’s needs and collaborate with you on tomorrow’s challenges.
    Logo Anl Web
    ANL is a high volume 2D material foundry and producer of monolayer graphene and other two-dimensional material sheets with a low defect density.
    Avishtech Logo
    With our industry-leading Gauss suite of printed-circuit simulation, design, and development software, and our exciting projects in the pipeline, Avishtech is your guide, your...