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Eye-Opening New Technologies at Realize LIVE

June 4, 2021
Editor Bill Wong highlights some of the standout presentations from the Siemens Realize LIVE conference.

Siemens Realize LIVE + U2U is an online event that’s open to everyone. Quite a bit of it is oriented toward Siemens’ wide array of products and most presentations have some relationship to those. Quite a few are more generic in nature, delving into the technology and methodologies.

The presentations are now available on-demand and range from automotive and printed-circuit-board (PCB) design to 5G Open RAN technology. I checked out a dozen sessions and cherry-picked a few, which are presented here.

The “5G Open RAN: An Analytics-Based Approach to Building and Optimizing SoCs and Networks session highlights picocom designs and markets Open RAN standard-compliant baseband platforms (Fig. 1). Topics include SoCs and carrier-grade software products for 5G small-cell infrastructure as well as challenges of building and optimizing Open RAN systems.

Moving into the automotive space, I found “Adopting a Digital Twin Approach to Optimize Electrified Vehicle Performance Engineering (Fig. 2). Many aspects of electric-car design benefit from a digital-twin approach. For example, frontloading design and optimization using simulations when developing a prototype provides significant insight prior to physical testing. This advanced validation limits costly design changes in later stages of development.

The range of Siemens’ product line is highlighted by the number of different topics at this online conference. The presentation “A New Methodology to Enhance the IC Packaging Planning and Prototyping Design Flow” delves into integrated-circuit design and packaging as well as PCB design (Fig. 3). The presentation touches on Siemens’ Xpedition Substrate Integrator, but also provides a general overview of the design considerations and issues.

The last one in my mix is another look at digital twins. “An Evolution of Performance Digital Twins to Executable Digital Twins examines the importance of executable digital twins (xDT), including development, validation, and deployment (Fig. 4). The presentation touches on Siemens’ MindSphere and Simcenter.

I need to go back to check out a few more sessions that I didn’t yet have a chance to view. Add a note below to let readers know if you find a good session.

About the Author

William G. Wong | Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

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I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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