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    IC Interconnect achieves ISO standards

    May 12, 2005
    IC Interconnect claims to be among the first wafer bumping service providers to complete the registration audit for ISO/TS 16949:2002 and 9001:2000, which encompass American (QS-9000), German (VDA6.1), French (EAQF) and Italian (AVSQ) automotive quality standards.

    IC Interconnect claims to be among the first wafer bumping service providers to complete the registration audit for ISO/TS 16949:2002 and 9001:2000, which encompass American (QS-9000), German (VDA6.1), French (EAQF) and Italian (AVSQ) automotive quality standards.

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