Unex, STMicro Team Up to Accelerate V2X Time-to-Market
Unex, a Taiwanese company that specializes in V2X (vehicle-to-everything) systems, has teamed up with STMicroelectronics to integrate Unex’s SOM-301 V2X System-on-Module onto STMicroelectronics’ Telemaco3P Modular Telematics Platform (TC3P-MTP).
Unex’s SOM-301 contains all V2X essential hardware and software components. SOM-301 devices integrate ST’s Teseo III automotive multi-constellation GNSS chip and Autotalks’ (Kfar Netter, Israel) CRATON2/PLUTON2 secure V2X chipset. CRATON2, designed by Autotalks and manufactured by STMicroelectronics, includes multiple defense layers such as secure boot, secure low-latency signing, line-rate verification of the entire V2X communication link, and a secure V2X firewall. In addition, Autotalks’ cryptographic-agile security engine supports field upgrades for assuring future security.
The PLUTON2 is a low-power, high-performance, multi-standard RFIC supporting dual-band IEEE802.11p, or single-band C-V2X direct communications supporting IEEE802.11a/b/g/n/ac protocols, making possible RF transmitter/receiver functionality.
Unex’s V2Xcast software stack enables extended capabilities for V2X processing. The CRATON2 on SOM-301 handles secure V2X communication on one side, while the Telemaco3P manages the applications, fusing the V2X messages with data from in-vehicle, Wi-Fi, or cellular networks.
Works with DSRC and C-V2X
One of the most unique aspects of the Unex SOM-301 is its compatibility with DSRC and C-V2X. While it’s imperative to start working on V2X now to avoid falling behind the competition, which technology do you adopt? DSRC and C-V2X have fundamentally different architectures, making it difficult to harmonize a single global solution. Both technologies are designed for safety by providing a framework for direct communication between vehicles, infrastructure, and other road users. Unex points out that the SOM-301 circumvents the crystal-ball-reading challenge because it’s compatible with both C-V2X and DSRC, meaning that car manufacturers can choose the standard that makes sense for their region, and serve all markets without needing a different V2X module.
Unex’s SOM-301 is a system-on-module compatible with both DSRC and C-V2X communications. (Source: Unex)
Previously, V2X protocol software had to be built and verified per platform per project, resulting in a duplicated effort, risk, and cost. Unex's homegrown V2Xcast technology delivers a ready-to-use V2X communication service for V2X applications. By utilizing V2Xcast, application developers can focus on the application development without worrying about the underlying communication technology.
Unex also offers a V2Xcast software development kit (SDK) to enable developers to more easily take advantage of the features and protocols available on the module. Engineers get example calls to the APIs so they can start writing their application to take advantage of the sensor fusion features of the Telemaco3P or perform V2X operations, among other things. And since the APIs are in C, the standard when dealing with such applications, it further increases the solution’s accessibility.
STMicro’s Telemaco3P Platform
The STMicroelectronics Telemaco3P Modular Telematics Platform provides an open development environment for prototyping advanced Smart Driving applications. At its core is ST’s Telemaco3P secure automotive processor, claimed as the industry’s first device with an embedded isolated Hardware Security Module (HSM). The platform provides positioning hardware with ST’s automotive-grade, multi-constellation GNSS Teseo IC and dead-reckoning sensors. It also offers direct connectivity to automotive buses such as CAN-FD, FlexRay, and BroadR-Reach (100Base-T1), as well as optional modules for Bluetooth, Wi-Fi, and LTE.
ST’s TC3P-MTP is the development platform for its Telemaco3P (STA1385) system-on-chip (SoC) for automotive. The STA1385 is a fully automotive (AEC-Q100 qualified Grade 2) SoC targeting processing solutions for telematics and connectivity applications, including cybersecurity protection. It features dual Arm Cortex-A7 processors running at up to 600 MHz, an embedded and independent HSM, an isolated subsystem based on ARM Cortex-M3 for the vehicle’s CAN interface. A full set of standard connectivity interfaces include a dual gigabit ETH AVB controller and Flexray. Using the TC3P-MTP, engineers can start prototyping more quickly and reduce the complexities inherent to the design of a custom PCB.
The integration of Unex’s production-ready SOM-301 onto ST’s Telemaco3P Modular Telematics Platform results in a solution that can easily be customized at both hardware and software levels. It ultimately enables near-final V2V and V2I application prototyping and shortens time-to-market.
“Integrating our V2X technology within the comprehensive STMicroelectronics Telemaco3P ecosystem was extremely important for us. After a quick and straightforward integration with the module and the platform, we are excited to have our SOM-301 on ST’s Telemaco3P MTP. The integrated offering provides a time-to-market accelerator for developers,” said Nick Lee, Executive VP of Unex Technology.
“The objective of our collaboration with Unex is to provide our partners and customers with an easier and faster path to V2X solutions. Together with our automotive GNSS solutions, this joint effort aims to accelerate the adoption of next-generation systems for autonomous and safer connected cars,” commented Antonio Radaelli, Director Infotainment, Automotive Digital Division, STMicroelectronics.
