Image Sensors Sharpen Focus

Dec. 1, 2006
Sensors continue to penetrate existing and new markets thanks to technological improvements. In imaging, end users are reaping the benefits of smaller image chips with higher levels of resolution—not to mention lower costs. And CMOS process technol

Sensors continue to penetrate existing and new markets thanks to technological improvements. In imaging, end users are reaping the benefits of smaller image chips with higher levels of resolution—not to mention lower costs. And CMOS process technology has been a key driver.

Toshiba has shrank CMOS image sensors for mobile phones to tinier sizes while maintaining high resolution. Its 3.2-Mpixel ET8EF6-AS and 2-Mpixel ET8EF2-AS silicon-on-a-chip devices are now being manufactured in pixel pitches of just 2.2 µm in a 1/4-in. format. Previous imaging chips measured 2.7 µm with a 1/3.2-in. format.

To extend camera-phone battery lifetimes, Capella's line of ambient-light sensors eliminates excessive backlighting. The CMOS3000/3200 Filtron devices also can be used in notebooks, DVD and MP3 players, PDAs, and GPS units. Each chip is a highly integrated device with an optical filter, a photodiode, a digital filter, and a 9-bit digital-to-analog converter (DAC).

Imaging advances have reached the security and surveillance camera market with OmniVision Technologies' single-chip OV7720 Camera-Chip IC. This 1/4-in. format VGA device targets high-sensitivity surveillance and IP/3G cameras. Unlike conventional analog cameras, it doesn't require an analog-to-digital converter (ADC). It features a resolution of 640 by 480 pixels and a 0.25-µm pixel pitch. It also operates at 60 frames/s.

X3 MARKS THE SPOT
For sheer levels of high resolution, Foveon's X3 concept has yielded a 14.1-Mpixel image sensor for professional digital single-lens-reflex (SLR) photography. The company says this development combines the power of digital image processing with the essence of photographic film.

In the X3's layered sensor design, each location in the grid has layered photosensors sensitive to all three primary colors. In contrast, digital camera sensors commonly use a mosaic Bayer filter sensor where each location is a single photosensor (pixel) sensitive to only one primary color.

The X3's image sensors have three layers of pixels. These layers are embedded in silicon to take advantage of the fact that red, green, and blue light penetrate silicon to different depths, forming the first and only image sensor that captures full color at every point in the captured image.

A SINGLE-PIXEL IMAGER
The present approach to higher-resolution imaging is to increase the number of pixels per given area, which is now in the megapixel range. But a technology that has been kicking around for a couple of decades is now in the news.

Researchers at Rice University are proposing a 1-pixel camera based on a single-photon detector that takes thousands of "rapid-fire" shots to capture the equivalent of a million pixels. They say their idea simplifies the hardware while enabling the imaging of a much wider light spectrum than present megapixel imagers (see the figure).

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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